Deskripsi Pekerjaan
Are you a visionary researcher looking to push the boundaries of semiconductor technology? The Institute of Microelectronics (IME), under the Agency for Science, Technology and Research (A*STAR), is seeking a highly skilled Scientist or Senior Scientist to join our Advanced Packaging team. This is a unique opportunity to work at the forefront of Plasma-Enhanced Chemical Vapor Deposition (PECVD) processes, contributing to next-generation packaging solutions that power the future of global technology.
In this role, you will lead research and development initiatives focused on PECVD modules, working with state-of-the-art infrastructure to develop innovative materials and thin-film processes. You will collaborate with industry partners and cross-functional teams to translate laboratory breakthroughs into scalable, industrial applications. If you are passionate about nanotechnology, materials engineering, and semiconductor advancement, we invite you to help us shape the future of electronics.
Tanggung Jawab
- Design and execute experiments for PECVD thin-film deposition to meet advanced packaging requirements.
- Lead R&D projects focusing on process optimization, material characterization, and defect reduction.
- Collaborate with cross-functional teams to integrate PECVD processes into complex advanced packaging architectures.
- Analyze complex data sets to drive process improvement and technical troubleshooting.
- Author high-impact technical reports and present findings at international conferences and industry workshops.
- Supervise junior researchers and contribute to a culture of technical excellence within the lab.
- Manage equipment maintenance and calibration to ensure high-performance research standards.
Kualifikasi
- Ph.D. in Materials Science, Chemical Engineering, Physics, or a related semiconductor-focused discipline.
- Proven expertise in PECVD processes and tool operation in a research or industrial cleanroom environment.
- Strong background in materials characterization techniques (e.g., SEM, TEM, XRD, Ellipsometry).
- Deep understanding of thin-film physics, adhesion mechanisms, and surface science.
- Track record of published research or successful industrial process transfer.
- Excellent communication and interpersonal skills, with the ability to lead collaborative research efforts.
- Ability to work independently while contributing to a diverse, high-performance team.