Deskripsi Pekerjaan
Join UTAC Group as an Engineer specializing in Plasma Dicing Process/Etching and become a key player in our advanced semiconductor manufacturing operations. In this critical role, you will be responsible for optimizing our plasma dicing processes to ensure maximum efficiency, yield, and quality standards. You will work closely with cross-functional teams to identify and resolve technical challenges, conduct thorough failure analysis, and implement innovative solutions that drive continuous improvement in our production processes.
As a Plasma Dicing Process Engineer, you will have the opportunity to work with cutting-edge technology and contribute to the advancement of semiconductor manufacturing. Your expertise will directly impact the quality and reliability of our products, making this an ideal position for engineers passionate about precision and innovation in the high-tech industry.
UTAC Group offers a dynamic work environment where your technical skills will be valued and developed through ongoing training and professional growth opportunities. If you are a detail-oriented engineer with a passion for solving complex technical problems and improving manufacturing processes, we encourage you to apply and join our team of industry professionals.
Tanggung Jawab
- Qualify and optimize plasma dicing processes to ensure maximum efficiency and yield
- Lead failure analysis investigations to identify root causes of process issues
- Implement process improvements to enhance product quality and reduce defects
- Provide technical support to production teams for process-related challenges
- Collaborate with cross-functional teams to develop and implement process solutions
- Document processes, procedures, and technical specifications
- Monitor and analyze process data to identify trends and opportunities for optimization
Kualifikasi
- Bachelor's degree in Engineering, Materials Science, or related field
- Minimum 3 years of experience in semiconductor manufacturing or related industry
- Expertise in plasma etching and dicing processes
- Strong analytical skills with experience in failure analysis
- Familiarity with statistical process control (SPC) methodologies
- Excellent problem-solving abilities and attention to detail
- Strong communication and collaboration skills for cross-functional work
- Experience with process optimization and yield improvement initiatives