Deskripsi Pekerjaan
Are you looking for a challenging role in the high-tech semiconductor industry? Join STATS ChipPAC as an Equipment Associate Engineer and contribute to cutting-edge semiconductor packaging technology. We are dedicated to identifying problems, maximizing yield, and reducing manufacturing costs. In this role, you will work closely with the manufacturing team to develop methods that enhance productivity and ensure top-tier quality standards. Your expertise will be vital in maintaining and optimizing high-tech equipment used in the packaging process. If you are passionate about process engineering and want to make a tangible impact in the electronics manufacturing sector, apply today!
Tanggung Jawab
- Monitor and troubleshoot semiconductor packaging equipment to ensure optimal performance and minimal downtime.
- Analyze process data and production logs to identify yield and quality issues, then implement corrective actions.
- Collaborate with cross-functional teams to develop methods for improving productivity and reducing manufacturing costs.
- Perform root cause analysis on equipment failures and coordinate with maintenance teams for repairs.
- Implement process control measures and statistical process control (SPC) to ensure consistent quality.
- Conduct regular equipment calibration and preventive maintenance checks.
- Document process changes and maintain detailed technical logs for future reference.
Kualifikasi
- Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related technical field.
- Minimum 1-3 years of experience in semiconductor manufacturing or process engineering.
- Strong understanding of semiconductor packaging processes and yield management principles.
- Proficiency in using statistical process control (SPC) tools and data analysis software.
- Excellent problem-solving skills, attention to detail, and ability to work under pressure.
- Ability to work in a fast-paced, high-precision manufacturing environment.
- Good communication skills and teamwork abilities.