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Engineering 🏢 Full Time ⭐️ Terverifikasi

Equipment Engineer (Die Prep/Surface Mount Technology)

TF AMD
Bayan Lepas, Penang
Estimasi Gaji
RM 4.900 – RM 6.000
Terbaru
Live Update
6 Juli 2026
Batas Akhir
6 Jul 2027

Deskripsi Pekerjaan

Join TF AMD's cutting-edge engineering team as an Equipment Engineer specializing in Die Preparation and Surface Mount Technology (SMT). In this critical role, you'll drive operational excellence by maximizing Overall Equipment Effectiveness (OEE) across our semiconductor manufacturing processes. You'll troubleshoot complex equipment issues, implement preventive maintenance strategies, and optimize performance parameters to ensure maximum productivity and minimal downtime. This position offers the opportunity to work with advanced semiconductor equipment in a dynamic environment, contributing directly to our mission of delivering high-quality electronic components to global markets.

As a key technical expert, you'll collaborate with cross-functional teams to solve engineering challenges, document maintenance procedures, and identify opportunities for continuous improvement. Your expertise will directly impact production efficiency, quality standards, and cost optimization initiatives. We're seeking a proactive engineer with a passion for precision and innovation to join our Bayan Lepas facility.

Tanggung Jawab

  • Provide technical expertise for Die Prep and SMT equipment maintenance, repair, and optimization
  • Maximize Overall Equipment Effectiveness (OEE) through preventive maintenance and performance monitoring
  • Diagnose and resolve complex equipment malfunctions to minimize production downtime
  • Develop and implement equipment improvement projects to enhance reliability and efficiency
  • Collaborate with production teams to align equipment performance with operational targets
  • Document maintenance procedures, equipment modifications, and troubleshooting protocols
  • Train operators on equipment operation and basic maintenance practices

Kualifikasi

  • Bachelor's degree in Electrical/Mechanical Engineering or related technical field
  • Minimum 3 years' experience in semiconductor equipment engineering
  • Strong knowledge of Die Preparation and Surface Mount Technology (SMT) processes
  • Proficiency in troubleshooting complex mechanical/electronic systems
  • Familiarity with preventive maintenance methodologies and OEE metrics
  • Experience with semiconductor manufacturing equipment (e.g., wire bonders, die attachers)
  • Strong analytical problem-solving skills and technical documentation abilities

Keahlian yang Dibutuhkan

Equipment Engineering Die Preparation Surface Mount Technology Technical Troubleshooting Preventive Maintenance OEE Optimization Semiconductor Manufacturing Equipment Maintenance

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