Deskripsi Pekerjaan
Join Efinix Technology (M) Sdn. Bhd. as an IC Assembly/Subcon Engineer and become the critical technical bridge between our semiconductor innovations and global OSAT partners. In this pivotal role, you'll orchestrate seamless collaboration with Outsourced Semiconductor Assembly and Test (OSAT) suppliers, ensuring our cutting-edge chips meet rigorous quality and performance standards. Your expertise will drive process optimization, resolve complex technical challenges, and maintain competitive advantages in semiconductor packaging. You'll work at the intersection of engineering excellence and supply chain management, directly impacting product reliability and market success. This position offers the opportunity to shape assembly strategies while advancing your career in a dynamic semiconductor environment.
Tanggung Jawab
- Manage technical relationships with OSAT suppliers to ensure alignment on assembly/test specifications and quality standards
- Oversee semiconductor packaging processes including wire bonding, die attach, and final testing
- Conduct root cause analysis for assembly defects and implement corrective actions
- Coordinate with internal R&D teams to transfer new packaging technologies to OSAT partners
- Monitor supplier performance metrics including yield, quality, and delivery timelines
- Develop and maintain assembly process documentation and quality control protocols
- Stay updated on industry packaging innovations and implement best practices
Kualifikasi
- Bachelor's degree in Electrical Engineering, Electronics Engineering, or related field
- Minimum 3 years experience in semiconductor assembly or OSAT operations
- Strong knowledge of IC packaging technologies (wire bonding, flip-chip, wafer-level packaging)
- Experience with quality management systems (ISO 9001, Six Sigma)
- Proficiency in technical problem-solving and failure analysis methodologies
- Excellent communication skills for cross-functional and supplier collaboration
- Familiarity with semiconductor test equipment and assembly automation
- Ability to travel internationally for supplier audits and process reviews