Deskripsi Pekerjaan
Join onsemi, a global leader in semiconductor solutions, as a Process Engineer I in our state-of-the-art manufacturing facility in Seremban. This entry-level role offers a unique opportunity to work hands-on with cutting-edge semiconductor processes. You will be instrumental in optimizing critical manufacturing operations including die bonding, solder printing, and dispensing technologies. The position requires a blend of technical expertise and innovative problem-solving to enhance yield, quality, and production efficiency. Collaborate with cross-functional teams to develop process improvements, troubleshoot technical challenges, and implement best practices. If you're a recent engineering graduate or early-career professional passionate about semiconductor manufacturing, this role provides a dynamic platform for professional growth while contributing to onsemi's mission of powering a safer, greener, and smarter future.
Tanggung Jawab
- Develop, implement, and optimize die bonding, solder printing, and dispensing processes
- Analyze process data to identify improvement opportunities and enhance yield
- Collaborate with cross-functional teams to resolve manufacturing issues
- Document processes and maintain accurate engineering documentation
- Support new product introduction (NPI) activities and process validation
- Ensure compliance with safety, quality, and industry standards
- Continuously seek innovative solutions to improve process efficiency
Kualifikasi
- Bachelor's degree in Mechanical, Electrical, Chemical, or Industrial Engineering
- Fresh graduates or up to 2 years of relevant manufacturing experience
- Strong analytical and problem-solving skills
- Familiarity with statistical process control (SPC) and design of experiments (DOE)
- Excellent communication and teamwork abilities
- Proficiency in MS Office and engineering software
- Ability to work in a fast-paced environment and adapt to changing priorities