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Engineering 🏢 Full Time ⭐️ Terverifikasi

Process Engineering Wirebond

onsemi
Lapu-Lapu City, Cebu
Estimasi Gaji
PHP 60.000 – PHP 90.000
Terbaru
Live Update
30 Juni 2026
Batas Akhir
30 Jun 2027

Deskripsi Pekerjaan

Be Part of a Multinational Semiconductor Company. onsemi is a global leader in semiconductor manufacturing, dedicated to powering a sustainable future. We are currently seeking a highly skilled and detail-oriented Process Engineering Wirebond professional to join our team in Cebu. In this role, you will play a critical part in ensuring the highest quality standards of our semiconductor packaging operations. You will work closely with cross-functional teams to optimize wire bonding processes, troubleshoot equipment issues, and drive continuous improvements that enhance yield and product reliability. If you are passionate about semiconductor technology and looking for a challenging opportunity in a dynamic environment, we want to hear from you.

Tanggung Jawab

  • Monitor and optimize wire bonding processes to ensure high yield rates and product reliability.
  • Perform root cause analysis (RCA) for process deviations and equipment failures.
  • Collaborate with the manufacturing team to implement corrective actions and process improvements.
  • Maintain and calibrate wire bonders and testing equipment to ensure optimal performance.
  • Develop, update, and validate Standard Operating Procedures (SOPs) for wire bonding operations.
  • Utilize statistical process control (SPC) tools to track process trends and quality metrics.
  • Participate in continuous improvement projects (CIP) and Six Sigma initiatives.
  • Ensure strict compliance with ISO standards and customer quality requirements.

Kualifikasi

  • Bachelor's degree in Electronics Engineering, Electrical Engineering, or related technical field.
  • Minimum of 2-5 years of experience in semiconductor manufacturing, specifically in wire bonding or packaging processes.
  • Proficiency in operating wire bonders (e.g., K&S, ASM) and using metrology tools.
  • Strong understanding of semiconductor failure analysis and process control methodologies.
  • Excellent problem-solving skills with the ability to troubleshoot complex mechanical and electrical issues.
  • Good communication skills and the ability to work effectively in a team-oriented environment.
  • Knowledge of safety regulations and quality management systems in a manufacturing setting.

Keahlian yang Dibutuhkan

Wirebonding Semiconductor Process Engineering Yield Improvement SPC Troubleshooting Metrology Electronics Engineering Packaging Root Cause Analysis

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