Deskripsi Pekerjaan
Join Syntiant as an R&D Semiconductor Packaging Specialist Engineer and drive the next evolution in microchip technology. We are looking for a passionate engineer to lead process development, optimization, and introduction of advanced packaging solutions for next-generation sensors and neuromorphic chips. In this pivotal role, you will utilize Design for Manufacturing (DFM) approaches to ensure the highest standards of reliability and performance.
You will work at the intersection of materials science and process engineering, collaborating with cross-functional teams to define material specifications, troubleshoot complex equipment, and implement innovative assembly methods. This is a unique opportunity to contribute to cutting-edge edge AI solutions in a state-of-the-art facility in Penang.
Tanggung Jawab
- Lead the development and optimization of semiconductor packaging processes, including wafer-level and package-level assembly techniques.
- Apply Design for Manufacturing (DFM) strategies to identify manufacturing risks and enhance yield rates.
- Select and qualify advanced materials and substrates to meet the stringent performance requirements of next-gen sensors.
- Analyze process data and yield metrics to implement continuous improvements and drive cost reduction initiatives.
- Troubleshoot and maintain packaging equipment to ensure maximum uptime and operational efficiency.
- Collaborate with R&D and test teams to resolve technical challenges related to device reliability and performance.
Kualifikasi
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field.
- Minimum of 3-5 years of hands-on experience in semiconductor packaging, assembly, or related R&D processes.
- Strong understanding of DFM principles and statistical process control (SPC) methodologies.
- Proficiency in analyzing production data and generating comprehensive engineering reports.
- Excellent problem-solving skills with the ability to work independently in a fast-paced, innovative environment.
- Strong communication skills and the ability to collaborate effectively with diverse engineering teams.