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Engineering 🏢 Full Time ⭐️ Terverifikasi

R&D Semiconductor Packaging Specialist Engineer

Syntiant
Perai, Penang
Estimasi Gaji
MYR 6.000 – MYR 9.000
Terbaru
Live Update
11 Juli 2026
Batas Akhir
11 Jul 2027

Deskripsi Pekerjaan

Join Syntiant's cutting-edge R&D team as a Semiconductor Packaging Specialist Engineer, where you'll drive innovation in next-generation microchip and sensor packaging solutions. This role involves developing, optimizing, and introducing advanced packaging processes using Design for Manufacturing (DFM) methodologies to ensure scalability and performance excellence. You'll collaborate with cross-functional teams to integrate novel materials, equipment, and processes that push the boundaries of semiconductor technology. Your work will directly impact the reliability and efficiency of our AI-powered edge devices through hands-on process characterization, yield improvement, and troubleshooting complex packaging challenges. If you're passionate about semiconductor innovation and thrive in dynamic R&D environments, this position offers the opportunity to shape the future of microelectronics.

Tanggung Jawab

  • Develop and optimize semiconductor packaging processes using DFM principles for next-gen microchips and sensors
  • Integrate novel materials, equipment, and methodologies to enhance packaging performance
  • Lead process characterization, qualification, and transfer to manufacturing
  • Troubleshoot and resolve packaging-related issues through root cause analysis
  • Collaborate with design, test, and production teams to align on packaging solutions
  • Document processes and maintain best practices for knowledge transfer
  • Stay current on industry trends in semiconductor packaging technologies

Kualifikasi

  • Bachelor's degree in Electrical Engineering, Materials Science, or related field (Master's preferred)
  • 3+ years of experience in semiconductor packaging process development
  • Strong knowledge of packaging materials, equipment, and DFM methodologies
  • Proficiency in experimental design and statistical process control
  • Experience with semiconductor characterization tools and techniques
  • Excellent problem-solving and analytical skills
  • Strong communication abilities for cross-functional collaboration

Keahlian yang Dibutuhkan

semiconductor packaging process development DFM microchips sensors materials engineering process optimization R&D troubleshooting characterization statistical analysis

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