Beranda Loker Detail
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Engineering 🏢 Full Time ⭐️ Terverifikasi

Senior/Lead Research Engineer (FAB), Bonding Process Control, IME

Agency for Science, Technology and Research
Singapore
Estimasi Gaji
SGD 90.000 – SGD 150.000
Live Update
3 Mei 2026
Batas Akhir
3 Mei 2027

Deskripsi Pekerjaan

Join A*STAR's Institute of Microelectronics (IME) as a Senior/Lead Research Engineer (FAB) and lead cutting-edge bonding process innovation in Singapore's premier research ecosystem. This pivotal role empowers you to spearhead the development, optimization, and control of advanced bonding techniques critical for next-generation semiconductor devices. You'll work in state-of-the-art facilities tackling complex microfabrication challenges while driving process excellence and reliability. Collaborate with multidisciplinary teams to integrate bonding solutions into full-scale production, ensuring compliance with industry standards and quality benchmarks. Your expertise will directly impact Singapore's technological advancement through pioneering research in materials science and process engineering.

Tanggung Jawab

  • Lead R&D and optimization of advanced bonding processes (e.g., thermocompression, anodic, adhesive) in semiconductor fabrication
  • Design and implement robust process control methodologies for bonding operations
  • Develop statistical process control (SPC) frameworks to ensure yield and reliability
  • Collaborate with cross-functional teams to integrate bonding processes into device fabrication flows
  • Investigate and resolve complex bonding failures through root cause analysis
  • Mentor junior engineers and researchers in bonding process technologies
  • Document processes and maintain compliance with safety and quality standards
  • Stay abreast of industry trends and emerging bonding technologies

Kualifikasi

  • PhD or Master's degree in Materials Science, Mechanical Engineering, Chemical Engineering, or related field
  • 5+ years of hands-on experience in bonding processes for semiconductor or MEMS fabrication
  • Expertise in process control, statistical analysis, and yield improvement methodologies
  • Strong background in materials characterization and failure analysis techniques
  • Proven leadership in managing R&D projects and technical teams
  • Familiarity with CAD tools, simulation software, and semiconductor manufacturing equipment
  • Excellent problem-solving skills with attention to detail and precision
  • Strong communication and collaboration abilities for cross-functional partnerships

Keahlian yang Dibutuhkan

bonding process control semiconductor fabrication process optimization statistical process control materials science failure analysis thermocompression bonding anodic bonding adhesive bonding R&D leadership SPC yield improvement MEMS semiconductor manufacturing

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