Deskripsi Pekerjaan
Join Micron Semiconductors as a Senior Package Development Engineer (Yield Engineering) and become a key player in driving robust semiconductor performance. This critical role bridges New Product Introduction (NPI) and High Volume Manufacturing (HVM), ensuring seamless transitions and optimal yield outcomes. You'll collaborate with cross-functional teams to analyze package development processes, identify improvement opportunities, and implement data-driven solutions that enhance product reliability and manufacturing efficiency. The position offers exposure to cutting-edge semiconductor technologies and requires a proactive approach to solving complex yield challenges in a fast-paced environment.
Tanggung Jawab
- Drive yield optimization and performance enhancement from NPI through HVM phases
- Analyze yield data to identify root causes of package-related failures
- Develop and implement robust testing methodologies for package qualification
- Collaborate with design, process, and manufacturing teams to resolve yield issues
- Establish yield metrics and monitoring systems for continuous improvement
- Support new package technology development and validation processes
- Document technical findings and implement corrective actions
Kualifikasi
- Bachelor's degree in Electrical/Mechanical Engineering, Materials Science, or related field
- 5+ years of experience in semiconductor packaging or yield engineering
- Strong knowledge of semiconductor manufacturing processes and failure analysis
- Proficiency in yield analysis tools (SPC, DOE, FMEA)
- Experience with NPI to HVM transition management
- Excellent problem-solving and data interpretation skills
- Familiarity with package design and assembly technologies
- Strong communication and cross-functional collaboration abilities