Deskripsi Pekerjaan
Join Infineon Technologies as a Senior Staff/Principal Engineer in Package Technology Development and lead the next generation of semiconductor packaging innovation. This pivotal role demands expertise in designing and developing advanced QFN, DSO, TSSOP, and TO packages that power cutting-edge electronic systems. You will drive end-to-end package lifecycle management, from conceptualization to production, ensuring optimal performance, reliability, and cost-efficiency. Collaborate with global R&D teams to translate market requirements into robust technical solutions while mentoring junior engineers. Your work will directly impact Infineon's leadership in automotive, industrial, and power semiconductor solutions.
We seek an innovator passionate about pushing packaging boundaries. You'll leverage state-of-the-art simulation tools, failure analysis techniques, and industry standards to solve complex thermal, mechanical, and electrical challenges. This position offers strategic influence in shaping packaging roadmaps and contributing to patentable innovations. If you thrive in fast-paced environments and aspire to shape the future of semiconductor packaging, Infineon provides the platform to excel.
Tanggung Jawab
- Lead design, development, and qualification of QFN, DSO, TSSOP, and TO semiconductor packages
- Drive end-to-end package lifecycle management from concept to mass production
- Optimize package performance through thermal, mechanical, and electrical analysis
- Collaborate with cross-functional teams (design, test, manufacturing) on integration
- Develop technical specifications and design documentation
- Mentor junior engineers and conduct technical reviews
- Implement industry standards (JEDEC, IPC) and quality control processes
- Research emerging packaging technologies and materials
Kualifikasi
- Bachelor's degree in Electrical/Electronics Engineering (Master's/PhD preferred)
- 10+ years semiconductor packaging experience with 3+ years in leadership
- Expertise in QFN, DSO, TSSOP, TO package architectures and manufacturing
- Proficiency in CAD tools (Cadence, Mentor Graphics) and simulation software
- Strong knowledge of semiconductor materials, processes, and reliability testing
- Experience with cross-functional project management
- Problem-solving skills for complex technical challenges
- Excellent communication and documentation abilities