Deskripsi Pekerjaan
Join Palomar Technologies as an Applications Engineer where you'll drive innovation in semiconductor packaging solutions. This pivotal role requires deep expertise in die bonding and wire bonding processes, with proficiency in programming advanced equipment and hands-on experience with cutting-edge packaging materials. You'll collaborate with cross-functional teams to develop, optimize, and troubleshoot critical processes that enable next-generation electronic devices. If you're passionate about precision engineering and want to contribute to high-impact projects in a dynamic environment, this opportunity offers significant growth potential in the heart of Singapore's tech hub.
Tanggung Jawab
- Design, implement, and optimize die bonding and wire bonding processes for advanced packaging applications
- Program and calibrate precision bonding equipment to meet stringent quality standards
- Develop technical documentation and process specifications for manufacturing teams
- Troubleshoot complex bonding issues and implement corrective actions
- Collaborate with R&D to validate new materials and process parameters
- Provide technical support to customers and internal stakeholders
- Conduct process capability studies and continuous improvement initiatives
Kualifikasi
- Bachelor's degree in Mechanical, Electrical, or Materials Engineering
- 3+ years of hands-on experience in die bonding and wire bonding processes
- Proficiency in programming bonding equipment (e.g., wire bonders, die attachers)
- Strong understanding of semiconductor packaging materials and substrates
- Experience with DOE (Design of Experiments) and statistical process control
- Excellent problem-solving skills with root cause analysis capabilities
- Effective communication skills for cross-functional collaboration