Deskripsi Pekerjaan
Join AIC Semiconductor's dynamic engineering team as a Clip Bond Engineer and drive innovation in semiconductor packaging. In this critical role, you'll develop, optimize, and maintain cutting-edge clip bonding processes that ensure the highest quality and reliability of semiconductor components. You'll collaborate with cross-functional teams to troubleshoot process challenges, implement industry best practices, and continuously improve manufacturing efficiency. This position offers the opportunity to work with advanced technology in a state-of-the-art facility while contributing to the advancement of microelectronics manufacturing.
AIC Semiconductor provides a collaborative environment where your expertise will directly impact product quality and production scalability. If you're passionate about precision engineering and semiconductor innovation, this role offers a unique platform to grow your career in Malaysia's high-tech sector.
Tanggung Jawab
- Develop, optimize, and sustain clip bonding processes for semiconductor packaging applications
- Design and execute process validation experiments to ensure bonding quality and reliability
- Collaborate with R&D teams to implement new bonding technologies and materials
- Analyze process data and implement corrective actions to improve yield and efficiency
- Document technical specifications, SOPs, and process control parameters
- Train production staff on clip bonding techniques and quality standards
- Ensure compliance with industry standards (IPC, JEDEC) and safety protocols
Kualifikasi
- Bachelor's degree in Materials Engineering, Mechanical Engineering, or related field
- Minimum 3 years of experience in semiconductor packaging or microelectronics
- Expertise in clip bonding, wire bonding, and die attach processes
- Proficient with process optimization tools and statistical analysis methods
- Familiarity with semiconductor failure analysis and root cause investigation
- Strong problem-solving skills with attention to detail
- Experience working in ISO-certified manufacturing environments