Deskripsi Pekerjaan
Micron Technology is at the forefront of innovation, and we are seeking a visionary Distinguished Member of Technical Staff (DMTS) to lead our advanced process development initiatives. In this pivotal role, you will spearhead the engineering efforts behind Chemical Mechanical Planarization (CMP) innovations critical to the success of our next-generation NAND memory technologies. As a Distinguished Member, you will set the technical direction for complex process challenges, working alongside world-class engineers to optimize yield, enhance performance, and drive the industry forward. This is a rare opportunity to make a substantial impact on the future of memory and solid-state storage while mentoring the next generation of engineering talent.
Our team is dedicated to pushing the boundaries of what is possible in semiconductor manufacturing. You will be responsible for defining the technical roadmap for CMP processes, ensuring they meet the rigorous demands of high-volume production. If you are a subject matter expert looking for a platform to lead high-stakes technical projects and influence the direction of next-gen memory products, this is the role for you.
Tanggung Jawab
- Lead the design, development, and optimization of advanced CMP processes for cutting-edge NAND memory nodes.
- Drive technical innovation to improve process yield, uniformity, and overall device performance.
- Mentor and guide junior engineers and research staff, fostering a culture of technical excellence and collaboration.
- Collaborate cross-functionally with product engineering, equipment vendors, and process integration teams to resolve complex technical issues.
- Define and execute experimental plans to validate new materials, slurry chemistries, and process flows.
- Lead root cause analysis for yield excursions and implement corrective engineering solutions with a focus on long-term reliability.
- Present technical findings, strategic roadmaps, and business cases to senior leadership and key stakeholders.
Kualifikasi
- PhD or Master’s degree in Chemical Engineering, Materials Science, Electrical Engineering, or a related engineering discipline.
- Minimum of 10 years of hands-on experience in semiconductor process development, with a strong focus on CMP or Memory manufacturing.
- Demonstrated history of technical leadership, managing complex projects, and driving innovation from concept to production.
- Deep understanding of semiconductor device physics, process integration, and advanced lithography/etch concepts.
- Strong proficiency in statistical process control (SPC), failure analysis, and advanced metrology techniques.
- Proven track record of delivering high-impact results in a high-volume manufacturing environment.