Deskripsi Pekerjaan
At Micron Semiconductors, we are transforming how the world uses information to enrich life for all. As a global leader in memory and storage solutions, our relentless innovation drives the technology that powers the data center, cloud, automotive, and mobile markets.
We are seeking a highly motivated and technically skilled Engineer or Senior Engineer, CE Product Yield Enhancement (PYE) to join our dynamic team in Singapore. In this critical role, you will be at the forefront of analyzing and resolving the most complex device failures, directly driving yield improvements and ensuring the highest quality and reliability of our cutting-edge memory products, including DRAM, NAND, and SSD solutions.
You will leverage state-of-the-art electrical (EFA) and physical failure analysis (PFA) techniques to overcome complex device failures. You will work closely with global cross-functional teams spanning R&D, Product Engineering, Quality, and Manufacturing to identify root causes, implement robust corrective actions, and champion continuous improvement initiatives.
Your deep expertise in semiconductor device physics and advanced fault isolation will be crucial in developing new methodologies and maintaining Micron's leadership in memory technology. If you are passionate about solving challenging problems and making a significant impact on world-class semiconductor products, we encourage you to apply.
Tanggung Jawab
- Lead complex electrical failure analysis (EFA) and physical failure analysis (PFA) to resolve top yield and quality issues for advanced memory products (DRAM, NAND, SSD).
- Collaborate with global Customer Engineering (CE) and Product Engineering (PE) teams to deeply understand customer return issues and drive robust RMA resolution.
- Develop and optimize new failure analysis methodologies and techniques, improving success rates and reducing overall turnaround time (TAT) for critical escalations.
- Perform detailed electrical characterization of memory devices using bench testers, parametric analyzers, and internal automated test equipment (ATE).
- Drive comprehensive root cause analysis (RCA) using formal problem-solving techniques (e.g., 8D, DMAIC) and effectively communicate findings to management and cross-functional teams.
- Partner with Design, Process Integration, and Manufacturing divisions to identify upstream root causes and implement robust corrective and preventive actions (CAPA) for sustained yield improvement.
- Mentor junior engineers and failure analysis technicians in advanced FA techniques, safety protocols, and analytical best practices.
- Maintain rigorous documentation of analysis scopes, procedures, findings, and recommendations, contributing to the global knowledge base.
Kualifikasi
- Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a closely related technical discipline.
- 3–10+ years of relevant experience in semiconductor failure analysis, product engineering, or device characterization (level commensurate with experience).
- Deep understanding of semiconductor device physics, including CMOS logic and advanced memory cell operations (DRAM/NAND).
- Hands-on proficiency with Electrical Failure Analysis (EFA) tools such as LIVA, OBIRCH, EMMI, and InGaAs; and Physical Failure Analysis (PFA) tools such as SEM, FIB, TEM, and Auger.
- Proficiency in statistical data analysis and visualization platforms (e.g., JMP, Python, Spotfire, or similar big data analytics tools).
- Demonstrated expertise in formal root cause analysis and problem-solving methodologies (8D, DMAIC, or Kepner-Tregoe).
- Excellent written and verbal communication skills, with a proven ability to influence and collaborate across multi-functional global teams.
- Prior experience in the semiconductor memory industry (DRAM, NAND, or emerging memory technologies) is strongly desired.