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Engineering 🏢 Full Time ⭐️ Terverifikasi

Equipment Staff Engineer (Pick & Place / Die Attach / Die Bond)

ams OSRAM
Bayan Lepas, Penang
Estimasi Gaji
MYR 120.000 – MYR 180.000
Live Update
3 Mei 2026
Batas Akhir
3 Mei 2027

Deskripsi Pekerjaan

Join ams OSRAM as an Equipment Staff Engineer specializing in Pick & Place, Die Attach, and Die Bond processes. This critical role involves the maintenance, optimization, and continuous improvement of semiconductor manufacturing equipment to ensure maximum efficiency and yield. You will be responsible for implementing cost-effective solutions, collaborating with process engineering teams to identify and resolve defects, and driving machine design improvements that enhance production capabilities. The ideal candidate will have a strong background in semiconductor equipment engineering, with a focus on precision manufacturing processes. You will play a pivotal role in maintaining equipment reliability, reducing downtime, and improving overall production efficiency. This position offers an excellent opportunity to work with cutting-edge technology in a dynamic and innovative environment, contributing directly to the advancement of semiconductor manufacturing capabilities.

Tanggung Jawab

  • Perform regular maintenance and troubleshooting of Pick & Place, Die Attach, and Die Bond equipment
  • Design and implement cost-effective improvements to machine performance and reliability
  • Collaborate with process engineering teams to optimize equipment parameters for maximum yield
  • Identify and resolve equipment-related defects to minimize production downtime
  • Develop and implement preventive maintenance programs to ensure equipment longevity
  • Analyze equipment performance data to identify trends and areas for improvement
  • Train and mentor junior engineers on equipment operation and maintenance procedures
  • Stay current with industry advancements in semiconductor manufacturing equipment

Kualifikasi

  • Bachelor's degree in Mechanical Engineering, Electrical Engineering, or related field
  • Minimum of 5 years of experience in semiconductor equipment engineering
  • Strong knowledge of Pick & Place, Die Attach, and Die Bond processes
  • Experience with machine design improvements and cost optimization
  • Proficiency in troubleshooting complex mechanical and electrical systems
  • Experience collaborating with cross-functional teams to solve technical challenges
  • Strong analytical skills with the ability to interpret equipment performance data
  • Excellent problem-solving abilities and attention to detail

Keahlian yang Dibutuhkan

Equipment Engineering Semiconductor Manufacturing Pick & Place Die Attach Die Bond Machine Maintenance Process Optimization Troubleshooting Mechanical Engineering Electrical Engineering

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