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Engineering 🏢 Full Time ⭐️ Terverifikasi

Field Engineer (Advanced Packaging)

Tokyo Electron Singapore Pte Ltd
North Region
Estimasi Gaji
SGD 4.500 – SGD 7.500
Live Update
12 Juli 2026
Batas Akhir
12 Jul 2027

Deskripsi Pekerjaan

Join Tokyo Electron, a global leader in semiconductor equipment manufacturing, and take your career to the next level as a Field Engineer (Advanced Packaging).

Beyond immediate operational support, this role is designed to build a strong professional foundation in semiconductor engineering. As a key member of our technical support team, you will be responsible for the on-site installation, maintenance, and troubleshooting of advanced packaging equipment. You will work directly with customers to ensure optimal machine performance, high yield rates, and minimal downtime in a fast-paced manufacturing environment.

This is an excellent opportunity for engineering graduates or professionals looking to specialize in high-growth areas such as 2.5D/3D packaging, Through-Silicon Via (TSV), and heterogeneous integration. You will gain exposure to state-of-the-art technology while developing a robust skillset in field service and customer relationship management.

Tanggung Jawab

  • Perform routine maintenance, installation, and repair of Tokyo Electron semiconductor equipment at customer sites.
  • Diagnose and troubleshoot complex technical issues related to advanced packaging processes and machinery.
  • Collaborate with customers to understand operational requirements and provide technical solutions to improve equipment efficiency.
  • Document daily activities, maintenance logs, and technical reports accurately.
  • Train customers on equipment operation, software updates, and best practices.
  • Monitor machine performance metrics and participate in process optimization initiatives.

Kualifikasi

  • Bachelor’s Degree in Electrical Engineering, Mechanical Engineering, or a related field.
  • Relevant internship or working experience in the semiconductor or Equipment/Process Services (EPS) industry is preferred.
  • Understanding of semiconductor manufacturing processes, specifically Advanced Packaging technologies.
  • Strong problem-solving skills and the ability to work independently in a field environment.
  • Excellent communication skills and a customer-centric mindset.
  • Willingness to travel to customer sites as required.

Keahlian yang Dibutuhkan

semiconductor advanced packaging field engineer equipment maintenance troubleshooting semiconductor equipment 2.5d packaging 3d packaging tsv customer support

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