Deskripsi Pekerjaan
Micron is seeking a visionary Front End Central Product Integration (FE cPIE) Principal Engineer to drive innovation in High Bandwidth Memory (HBM) product integration. Join our global team in Singapore to lead cutting-edge semiconductor solutions that shape the future of computing. This role offers the opportunity to architect complex system architectures, optimize performance at the silicon level, and collaborate with cross-functional teams to deliver breakthrough memory technologies. You'll pioneer integration strategies for next-generation memory products while mentoring engineering talent and setting technical roadmaps for emerging markets.
In this senior position, you'll tackle unprecedented technical challenges in memory design, working at the intersection of hardware architecture, system integration, and performance optimization. Micron provides a dynamic environment where your expertise will directly impact the development of industry-leading memory solutions used in AI, data centers, and advanced computing systems.
Tanggung Jawab
- Lead end-to-end front-end product integration for HBM and advanced memory architectures
- Define system-level integration strategies for next-generation semiconductor products
- Collaborate with design, verification, and manufacturing teams to ensure seamless component integration
- Drive performance optimization and power efficiency at the silicon integration level
- Mentor senior engineers and establish technical best practices for product integration
- Resolve complex system integration challenges through root cause analysis
- Contribute to product architecture decisions and cross-functional roadmapping
Kualifikasi
- Bachelor's degree in Electrical/Computer Engineering or related field; Master's or PhD preferred
- 10+ years of semiconductor design experience with 5+ years in product integration
- Expertise in HBM, GDDR, or advanced memory technologies
- Deep knowledge of front-end design flows including RTL, verification, and synthesis
- Proven leadership experience in cross-functional engineering teams
- Strong analytical skills for complex system-level problem solving
- Experience with performance modeling and timing closure methodologies