Deskripsi Pekerjaan
We are exclusively representing a world-leading semiconductor manufacturer to find a passionate and experienced Lithography Process Engineer. This exciting opportunity is based in the Central Region and offers a platform to work on the most advanced technology nodes in the industry. As a Lithography Process Engineer, you will be the technical backbone of the photo module, ensuring processes are stable, efficient, and ready for the next generation of chips.
Your day-to-day responsibilities will involve complex problem-solving, from tackling systematic defects to fine-tuning overlay and critical dimension budgets. You will drive experiments to characterize new photoresists and materials, optimize scanner and track parameters, and collaborate with integration teams to ramp new products. The ability to analyze large datasets, using tools like JMP or Spotfire, is crucial to identifying root causes and implementing robust corrective actions.
This role demands a deep understanding of scanner optics (DUV/EUV), chemical reactions in resist, and the physical aspects of plasma etching/ashing. You will be the process authority during shift transitions and escalation calls, providing clear technical guidance. Adecco is committed to your career growth; joining this client means accessing world-class training and a clear career ladder into senior technical or management positions.
The successful candidate will thrive in a high-volume manufacturing environment where precision and speed are paramount. An attractive remuneration package is offered, including a monthly base salary of SGD 6,000 to SGD 9,000, 13th-month AWS, and a generous variable bonus based on company and individual performance. If you are ready to take the next step in your semiconductor career, we want to hear from you.
Tanggung Jawab
- Own and optimize photolithography processes including coat, expose, and develop tracks for advanced nodes.
- Monitor and improve critical parameters such as Critical Dimension (CD), overlay, and defect density to meet stringent roadmap targets.
- Conduct DOE to characterize new materials (photoresists, BARC, developers) and process conditions.
- Troubleshoot and disposition lot-level process deviations and tool-related anomalies using FDC/SPC systems.
- Drive root cause analysis for systematic defects and implement permanent corrective actions (LPAs, SPS).
- Collaborate with scanner and track equipment engineers on tool matching, setup, and advanced process control (APC) strategies.
- Support new product introduction (NPI) by establishing lithography recipes and verifying process windows.
- Author and update Standard Operating Procedures (SOPs), FMEA, and control plans for the lithography module.
Kualifikasi
- Bachelor's or Master's Degree in Chemical Engineering, Electrical Engineering, Physics, Materials Science, or Microelectronics.
- Minimum 3 years of hands-on experience in a semiconductor wafer fab, specifically in the Lithography (Photo) module.
- Strong technical understanding of DUV and EUV lithography principles, including resolution limits, NILS, MEEF, and LWR.
- Hands-on experience with lithography equipment (ASML scanners, TEL/Sokudo tracks) and metrology tools (SEM, OCD, Overlay).
- Proficiency in data analysis and statistical software (JMP, Spotfire, or similar SPC tools).
- Experience with advanced process control (APC), run-to-run control (R2R), and database systems (e.g., Promis, Workstream).
- Excellent communication, documentation, and cross-functional teamwork skills.
- Proven track record of solving complex problems and driving yield improvements in a high-volume manufacturing environment.