Deskripsi Pekerjaan
Are you an expert in semiconductor assembly technology with a passion for driving customer success? Kulicke & Soffa is seeking a highly skilled Technical Solution Manager (TSM) to lead our Ball Bonder (BB) and Wedge Bonder (WB) initiatives in Malaysia. In this pivotal role, you will act as the primary technical interface for our high-value customers, translating complex engineering challenges into scalable, high-performance assembly solutions.
As a TSM, you will bridge the gap between our cutting-edge R&D and our clients' production floors, ensuring optimal machine performance, process reliability, and technological integration. We are looking for a strategic leader capable of identifying growth opportunities while providing hands-on technical guidance. If you thrive in a collaborative environment and want to shape the future of microelectronic packaging, we want to hear from you.
Tanggung Jawab
- Lead technical engagements with key clients to resolve complex process challenges related to Ball and Wedge bonding equipment.
- Provide expert-level guidance on process optimization, yield improvement, and throughput enhancement for semiconductor assembly lines.
- Collaborate cross-functionally with R&D, product marketing, and global support teams to align product roadmaps with specific customer needs.
- Conduct regular site visits to troubleshoot equipment issues and provide training to client engineering teams.
- Develop and present technical proposals that demonstrate the value of K&S bonding solutions in competitive environments.
- Monitor industry trends in semiconductor packaging to identify new market opportunities for our BB and WB portfolios.
- Coordinate with internal project managers to ensure timely delivery of technical support and equipment installations.
Kualifikasi
- Bachelor’s degree in Mechanical, Electrical, Chemical Engineering, or a related field (Master’s degree is a plus).
- Minimum 5-8 years of experience in semiconductor assembly, specifically within the backend packaging industry.
- In-depth technical knowledge of Ball Bonder and Wedge Bonder machinery and wire bonding processes.
- Proven ability to manage high-level customer relationships and handle technical escalation processes effectively.
- Strong problem-solving skills with a data-driven approach to technical diagnostics.
- Excellent communication and presentation skills, with the ability to articulate complex technical concepts to non-technical stakeholders.
- Willingness to travel locally and internationally as required to support customer facilities.