Deskripsi Pekerjaan
At Micron, we are transforming how the world uses information to enrich life for all. Join our cutting-edge NAND Process Development team in Singapore as a Member of Technical Staff (MTS) specializing in Dry Etch. This is a unique opportunity to lead critical modules at the forefront of semiconductor scaling.
As a key technical contributor, you will be responsible for developing, characterizing, and optimizing advanced dry etch processes for next-generation NAND memory nodes. You will work in a highly collaborative, fast-paced environment, tackling complex challenges in pattern transfer, high-aspect-ratio etching, and defect reduction. Your expertise will directly impact the performance, yield, and reliability of Micron's world-class memory solutions.
In this role, you will own the dry etch module roadmap for specific technology nodes. You will work closely with global teams in the US and Japan to align on integration schemes and process specifications. A key part of your day-to-day responsibilities will involve designing and executing complex Design of Experiments (DOE), interpreting physical and electrical data (SEM, TEM, CD-SEM, e-test), and making data-driven decisions to converge on the best process window.
We are looking for a deep technical expert who can lead without authority. You will be expected to mentor junior engineers, champion technical reviews, and drive a culture of rigorous experimental design. Your ability to communicate complex technical concepts across different functions (Integration, Device, Quality, Manufacturing) will be critical to your success and the success of the team.
Beyond technical execution, this role offers significant opportunities for strategic impact. You will contribute to Micron's extensive IP portfolio, represent the company at international technical conferences, and help shape the future of memory technology.
If you are a passionate process engineer with deep dry etch expertise and a drive for innovation, we want to hear from you. Come join us at our state-of-the-art facility in Singapore and make your mark on the world of semiconductors.
Tanggung Jawab
- Lead the development and optimization of critical dry etch processes for advanced NAND memory nodes (e.g., 3D NAND).
- Design and execute Design of Experiments (DOE) to characterize etch rate, uniformity, profile, selectivity, and defectivity.
- Collaborate with integration, metrology, equipment, and device teams to resolve complex process integration challenges.
- Drive yield improvement and defect reduction initiatives through systematic root cause analysis and implementation of corrective actions.
- Mentor and develop junior process engineers and technicians, fostering a culture of technical excellence and innovation.
- Evaluate and qualify new etch equipment, consumables, and chemistries for high-volume manufacturing readiness.
- Contribute to Micron's intellectual property portfolio through patent disclosures and represent Micron at technical conferences.
Kualifikasi
- Ph.D. or Master’s degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field.
- 5+ years of hands-on experience in semiconductor dry etch process development (NAND/3D NAND experience is highly preferred).
- Deep understanding of plasma physics, gas-phase and surface chemistry, and ion bombardment effects.
- Proven track record of solving complex etch issues such as Aspect Ratio Dependent Etching (ARDE), micro-loading, bowing, and twisting.
- Proficiency in statistical data analysis tools (JMP, Python, or MATLAB) and Design of Experiments (DOE) methodology.
- Experience with advanced process control (APC), fault detection and classification (FDC), and run-to-run control (R2R) is a strong plus.
- Excellent written and verbal communication skills, with a demonstrated ability to work effectively in a global, cross-functional team.
- Strong publication and/or patent record demonstrating innovative and independent thinking.