Deskripsi Pekerjaan
Nezda Technologies is seeking a high-caliber Modules Supervisor to join our expanding team in the Clark Freeport Zone. In this critical role, you will lead the end-to-end execution of complex semiconductor programs, with a primary focus on wirebond and assembly operations. You will be instrumental in driving operational excellence, optimizing production cycles, and ensuring that our output meets the highest standards of global semiconductor quality.
As a Modules Supervisor, you will provide technical leadership to your team, troubleshooting bottlenecks, maintaining process integrity, and fostering a culture of safety and efficiency. If you are a proactive leader with a deep understanding of semiconductor manufacturing processes and a passion for technical optimization, we invite you to advance your career with one of the industry's most innovative tech providers.
Tanggung Jawab
- Oversee end-to-end wirebond and assembly operations to ensure adherence to production schedules and quality standards.
- Lead, mentor, and supervise production personnel, fostering a collaborative and high-performance work environment.
- Identify, analyze, and resolve technical bottlenecks in the assembly process to maximize throughput and yield.
- Monitor key performance indicators (KPIs) related to production output, cycle time, and machine downtime.
- Enforce strict compliance with safety, health, and environmental policies on the manufacturing floor.
- Coordinate with cross-functional departments including Maintenance, Engineering, and Quality Control to optimize process flow.
- Implement continuous improvement initiatives (e.g., Lean, Six Sigma) to reduce waste and enhance operational efficiency.
Kualifikasi
- Bachelor’s degree in Engineering (Mechanical, Electrical, Electronics, or Industrial) or a related technical field.
- Minimum of 3-5 years of supervisory experience in a semiconductor assembly or backend manufacturing environment.
- Strong technical expertise in wirebonding processes, equipment operation, and semiconductor packaging.
- Proven ability to analyze production data and implement corrective actions.
- Excellent communication and leadership skills with the ability to manage diverse teams in a 24/7 manufacturing setting.
- Proficiency in computer-based inventory and production management systems (ERP/MES).
- Strong knowledge of ISO standards and safety regulations in a high-tech manufacturing environment.