Deskripsi Pekerjaan
Micron is seeking a visionary Process Pathfinding Lead to spearhead the next generation of 3D NAND and NVM technology. In this pivotal role, you will lead the pathfinding efforts to overcome critical technical barriers and drive scaling innovations that define the future of memory. You will collaborate with cross-functional teams to develop novel process flows, optimize yield, and reduce variability in advanced semiconductor nodes.
This is a unique opportunity to shape the technical roadmap for cutting-edge semiconductor manufacturing. You will be at the forefront of R&D, utilizing your deep technical expertise to solve complex challenges in lithography, etching, and thin film processes. If you are passionate about pushing the boundaries of what is possible in memory technology and want to make a tangible impact on the industry, we want to hear from you.
Tanggung Jawab
- Lead the strategic process pathfinding for next-generation 3D NAND and NVM technologies to ensure successful scaling and yield improvement.
- Develop and evaluate innovative process solutions to overcome fundamental scaling challenges in advanced nodes.
- Collaborate closely with device engineers and fab operations teams to transition new process concepts from the lab to pilot line production.
- Analyze complex process data and yield metrics to drive continuous improvement and implement robust corrective actions.
- Mentor and guide a team of talented SMTS/DMTS engineers, fostering a culture of technical excellence and innovation.
- Define the technical specifications and long-term roadmap for critical process modules and modules in development.
- Conduct feasibility studies and comprehensive risk assessments for novel process concepts to de-risk technology adoption.
Kualifikasi
- Master’s or Ph.D. degree in Electrical Engineering, Materials Science, Chemical Engineering, or a related technical field.
- Minimum of 8 years of experience in semiconductor process development, with a strong focus on NAND Flash or memory devices.
- Demonstrated experience in 3D NAND scaling, process integration, and pathfinding strategies.
- Strong background in one or more key process areas: lithography, etching, deposition, or thin film processing.
- Proven track record of leading cross-functional R&D teams and successfully delivering projects on time.
- Excellent analytical skills with the ability to troubleshoot and solve complex process integration issues.
- Ability to thrive in a fast-paced, high-technology environment with tight deadlines.