Deskripsi Pekerjaan
Micron Semiconductors is a global leader in innovative memory and storage solutions. Our Singapore site is a dynamic hub for some of the world's most advanced NAND flash and SSD development and manufacturing.
We are seeking an enthusiastic and detail-oriented NTI Physical Failure Analysis Technician to join our world-class Failure Analysis team. This role offers a unique opportunity to work with the latest memory technologies and play a pivotal part in ensuring the quality, reliability, and performance of our cutting-edge products.
As part of the New Technology Introduction (NTI) team, you will be at the forefront of solving complex technical challenges. You will utilize advanced tools such as Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), and Transmission Electron Microscopy (TEM) to analyze physical defects and identify root causes of failures. Your work will directly contribute to optimizing processes and accelerating the development of next-generation memory devices.
The stimulating, collaborative environment provides excellent opportunities for professional development. You will interact with cross-functional teams including Process Integration, Product Engineering, and R&D, broadening your technical expertise. If you are passionate about hands-on failure analysis and eager to grow your career in the semiconductor industry, we want to hear from you. Join Micron Semiconductors and help transform how the world uses information to enrich life.
Tanggung Jawab
- Conduct hands-on physical failure analysis (PFA) on advanced memory products, including DRAM, NAND, and SSDs.
- Utilize state-of-the-art failure analysis tools such as Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), and Emission Microscopy (EMMI).
- Collaborate closely with New Technology Introduction (NTI) teams to resolve process and device related issues during the development phase.
- Interpret electrical test data and correlate them with physical defects to determine root cause.
- Prepare detailed technical reports and present findings to cross-functional engineering teams.
- Ensure rigorous adherence to safety protocols and maintain a high standard of lab cleanliness.
- Contribute to the development and optimization of new FA techniques and methodologies.
Kualifikasi
- Diploma or Bachelor's degree in Microelectronics, Electrical Engineering, Materials Science, Physics, or a related field.
- Minimum 2 years of hands-on experience in semiconductor failure analysis, preferably in a memory or logic environment.
- Strong understanding of semiconductor device physics and memory technologies (DRAM, NAND, etc.).
- Proficiency in operating FIB, SEM, TEM, and other PFA tools.
- Excellent analytical and problem-solving skills with meticulous attention to detail.
- Ability to work effectively in a dynamic, fast-paced, and collaborative team environment.
- Strong verbal and written communication skills in English.