Deskripsi Pekerjaan
Are you an innovative and detail-oriented engineer passionate about cutting-edge semiconductor packaging? Broc, a rapidly growing technology company at the forefront of developing advanced electronics solutions, is seeking a talented Package Assembly Design (PAD) Engineer to join our dynamic team in Klang/Port Klang, Malaysia. This is an exceptional opportunity to be at the forefront of product development, where your expertise will directly influence the performance, reliability, and manufacturability of our next-generation electronic devices that power tomorrow's innovations.
As a Package Assembly Design (PAD) Engineer at Broc, you will play a pivotal role in bridging the gap between sophisticated chip design and high-volume manufacturing. You will be responsible for the intricate design, development, and optimization of semiconductor packages, ensuring they meet rigorous performance specifications, thermal requirements, and signal integrity while being cost-effective and robust for mass production. Your daily activities will involve utilizing advanced CAD tools, conducting comprehensive Design for Manufacturability (DFM) and Design for Assembly (DFA) analyses, and collaborating closely with our R&D, product development, test, and manufacturing teams. You will be instrumental in driving innovation from concept to market, ensuring our products stand out in a competitive global landscape.
Broc fosters a collaborative and innovative environment where engineers are empowered to tackle complex challenges, explore new technologies, and contribute to groundbreaking solutions. We are committed to nurturing talent and providing ample opportunities for professional growth and development within a supportive team culture. If you are a proactive problem-solver with a strong background in semiconductor packaging technologies, a keen eye for detail, and a drive to innovate, we invite you to explore this exciting career path with us. Join Broc and help us shape the future of electronics – apply today and make your mark!
Tanggung Jawab
- Lead the design and development of innovative semiconductor package solutions, including BGA, QFN, CSP, and lead frame packages, ensuring optimal electrical, thermal, and mechanical performance.
- Perform comprehensive Design for Manufacturability (DFM) and Design for Assembly (DFA) analyses to ensure robust, cost-effective, and high-yield manufacturing processes.
- Collaborate closely with internal cross-functional teams, including IC design, test engineering, product engineering, and manufacturing, to define package requirements and resolve design-related challenges.
- Select and evaluate packaging materials, conduct material characterization, and assess their impact on package reliability and performance.
- Develop and maintain detailed design specifications, assembly process flows, and documentation for new package introductions.
- Provide technical support and troubleshooting expertise for package assembly issues during pilot runs and mass production.
- Stay abreast of industry trends, emerging packaging technologies, and competitive landscape to drive continuous improvement and innovation within Broc.
Kualifikasi
- Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Materials Science, or a closely related technical field.
- Minimum of 3-5 years of hands-on experience in semiconductor package design, development, or assembly engineering.
- Proficiency with industry-standard CAD/EDA tools for package design and layout (e.g., Cadence APD, Allegro Package Designer, AutoCAD, SolidWorks).
- Strong understanding of various semiconductor packaging technologies, such as wire bonding, flip-chip, WLP, SiP, and advanced substrate technologies.
- Knowledge of packaging materials, their properties, and common failure mechanisms (e.g., warpage, delamination).
- Familiarity with industry standards and reliability test methods for semiconductor packages (e.g., JEDEC).
- Excellent analytical, problem-solving, and critical thinking skills with a keen attention to detail.
- Ability to communicate complex technical information effectively and collaborate seamlessly in a fast-paced, team-oriented environment.