Deskripsi Pekerjaan
Join Monolithic Power Malaysia as a Principal Engineer in Packaging Engineering and lead cutting-edge packaging solutions for our rapidly expanding IC portfolio. This pivotal role demands technical leadership in developing innovative packaging strategies that enhance product performance, reliability, and manufacturability. You'll collaborate with global R&D teams to drive packaging technology advancements while optimizing cost and scalability. Our dynamic environment offers opportunities to shape next-generation packaging solutions for high-power and high-density semiconductor applications. Enjoy competitive compensation, professional development opportunities, and the chance to impact a fast-growing industry leader in power semiconductors.
Tanggung Jawab
- Lead end-to-end packaging engineering projects from concept to production
- Design and optimize advanced packaging solutions for IC products
- Collaborate with cross-functional teams (design, manufacturing, quality)
- Drive innovation in material selection and process improvement
- Develop and implement packaging reliability testing protocols
- Mentor junior engineers and provide technical guidance
- Ensure compliance with industry standards and regulatory requirements
Kualifikasi
- Bachelor's degree in Electrical/Mechanical Engineering or related field; Master's preferred
- Minimum 8+ years of experience in IC packaging engineering
- Expertise in semiconductor packaging technologies (e.g., QFN, BGA, WLCSP)
- Strong knowledge of materials science and thermal management
- Experience with CAD tools and packaging simulation software
- Proven track record in leading complex engineering projects
- Excellent problem-solving and analytical skills