Deskripsi Pekerjaan
Join Renesas, a global leader in semiconductor solutions, and become part of a team committed to shaping the future of electronics. Our facility in Teluk Panglima Garang is a key manufacturing hub, and we are seeking a talented Process Engineer to specialize in Die Bond processes. This role offers the opportunity to work with cutting-edge equipment and contribute to the production of advanced microchips that power a wide range of applications from automotive to IoT.
As a Process Engineer (Die Bond), your primary responsibilities will include the setup, optimization, and troubleshooting of die bond equipment. You will analyze process data to identify areas for yield improvement and cost reduction, implementing corrective actions to enhance overall equipment effectiveness (OEE). Collaborating with cross-functional teams, you will develop and maintain process documentation, standard operating procedures (SOPs), and training materials for operators and technicians.
We are looking for an engineer who is proactive, analytical, and dedicated to continuous learning. You will have the chance to develop your skills in a supportive environment, with access to training programs and career progression opportunities. If you are ready to make a significant impact in semiconductor manufacturing, apply today.
Tanggung Jawab
- Set up, calibrate, and optimize Die Bond machines for various product requirements
- Monitor and analyze process parameters to ensure consistent quality and yield
- Troubleshoot equipment and process issues, implementing effective solutions to minimize downtime
- Collaborate with maintenance and production teams to improve equipment performance and reliability
- Lead yield improvement projects, utilizing data-driven analysis and engineering methodologies
- Develop and maintain process documentation, including SOPs and control plans
- Train operators and technicians on new processes and best practices
- Drive cost reduction initiatives through process optimization and waste elimination
Kualifikasi
- Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Manufacturing Engineering, or a related field
- Minimum 2–3 years of hands-on experience with Die Bond equipment in a semiconductor assembly environment
- Strong understanding of semiconductor packaging processes and quality standards
- Proficiency in statistical process control (SPC) and data analysis tools
- Excellent problem-solving skills and ability to work under pressure in a fast-paced manufacturing setting
- Effective communication skills and ability to work collaboratively in a team
- Knowledge of lean manufacturing principles and continuous improvement methodologies
- Experience with automated assembly equipment is a plus