Deskripsi Pekerjaan
Are you ready to kickstart your career with a global leader in intelligent power and sensing technologies? onsemi is seeking a dynamic and detail-oriented Project Engineer I to join our Packaging & Assembly team in Seremban. In this pivotal role, you will be at the heart of our New Product Introduction (NPI) process, ensuring that cutting-edge semiconductor solutions move seamlessly from conceptual design to high-volume manufacturing.
As a Project Engineer, you will bridge the gap between technical design and operational execution. You will work within a high-speed, collaborative environment where your ability to manage timelines, mitigate risks, and communicate across departments will directly impact the success of our global product portfolio. This is an exceptional opportunity for a junior engineering professional to gain deep exposure to the semiconductor lifecycle and develop world-class project management skills.
We provide a supportive ecosystem where innovation is encouraged and professional growth is a priority. If you are passionate about semiconductor technology and possess the organizational prowess to lead complex projects to completion, we want to hear from you.
Tanggung Jawab
- Lead and coordinate multiple NPI (New Product Introduction) projects simultaneously, ensuring all milestones are met from concept through to mass production.
- Develop detailed project schedules, resource plans, and budget estimates to ensure cost-effective execution.
- Facilitate cross-functional meetings between R&D, Quality Assurance, and Manufacturing teams to align on technical requirements.
- Monitor and report on project progress, identifying potential bottlenecks and implementing proactive mitigation strategies.
- Ensure all packaging and assembly processes comply with internal quality standards and international semiconductor regulations.
- Manage technical documentation including Bills of Materials (BOM), process flowcharts, and risk assessment reports (FMEA).
- Interface with external vendors and internal stakeholders to ensure material availability and equipment readiness for trial runs.
- Drive continuous improvement initiatives to optimize the NPI cycle time and reduce development costs.
Kualifikasi
- Bachelor’s Degree in Mechanical, Electrical, Materials Engineering, or a related technical field.
- Fundamental understanding of semiconductor packaging technologies and assembly processes.
- Strong interest or certification in Project Management (e.g., CAPM or PMP) is highly preferred.
- Excellent analytical skills with the ability to interpret complex technical data and drawings.
- Proficiency in project management software (MS Project, Jira) and Microsoft Office Suite.
- Strong communication skills in English, both written and verbal, for effective global collaboration.
- Ability to work independently in a fast-paced, high-pressure manufacturing environment.
- Entry-level candidates with strong internship experience in semiconductors are encouraged to apply.