Deskripsi Pekerjaan
Are you passionate about pushing the boundaries of semiconductor packaging technology? The Agency for Science, Technology and Research (A*STAR) is seeking a talented Research Engineer to join our team in Singapore, focusing on Temporary Bonding and Debonding (TBDB) processes for Advanced Packaging Technology (APM) at the Institute of Microelectronics (IME).
In this dynamic role, you will lead the development and optimization of TBDB processes that are critical for enabling high-density, high-performance semiconductor devices. You will collaborate with multidisciplinary teams to design experiments, characterize process parameters, and troubleshoot issues to achieve robust and reliable packaging solutions. Your work will involve conducting literature reviews, analyzing data, and presenting findings to both internal and external stakeholders.
Key aspects of this position include the design and implementation of novel bonding and debonding techniques, optimization of process flow for improved yield and cost-efficiency, and ensuring compliance with industry standards. You will also contribute to the development of process specifications and technical documentation, and mentor junior researchers as needed.
Ideal candidates should have a strong background in materials science, chemical engineering, or electrical engineering, with prior experience in semiconductor packaging processes. You will possess excellent problem-solving skills, the ability to work in a fast-paced research environment, and a passion for innovation. This is an excellent opportunity to work on groundbreaking projects, access state-of-the-art facilities, and contribute to the advancement of Singapore's research ecosystem.
We offer competitive compensation, professional development opportunities, and a supportive work environment. Join us and make a significant impact on the future of electronics.
Tanggung Jawab
- Design and develop TBDB processes for advanced semiconductor packaging applications.
- Conduct experiments and characterize process parameters to optimize yield and reliability.
- Collaborate with cross-functional teams to integrate TBDB into packaging workflows.
- Analyze data and troubleshoot issues to ensure robust process performance.
- Document process specifications, technical reports, and present findings to stakeholders.
- Stay updated with the latest advancements in bonding and debonding technologies.
Kualifikasi
- Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, or related field.
- Experience with bonding and debonding processes in semiconductor packaging is highly desirable.
- Strong analytical and problem-solving skills with proficiency in data analysis tools.
- Excellent communication and teamwork abilities.
- Ability to work independently and manage multiple projects concurrently.
- Proficiency in statistical methods and design of experiments (DOE).