Deskripsi Pekerjaan
Are you a visionary Research Scientist passionate about pushing the boundaries of semiconductor technology and eager to make a tangible impact on the future of electronics? The Agency for Science, Technology and Research (A*STAR), Singapore's leading public sector agency championing world-class scientific research and innovation, invites you to join our dynamic team at the prestigious Institute of Microelectronics (IME). We are seeking an exceptional and highly motivated individual to spearhead advancements in Wafer-to-Wafer (W2W) Bonding within our critical Advanced Packaging Materials (APM) division.
This is an unparalleled opportunity to pioneer cutting-edge semiconductor bonding techniques that are absolutely critical for enabling next-generation 3D integration, heterogeneous integration, and advanced system-on-chip (SoC) architectures. As a key member of our innovative R&D team, you will be at the forefront of developing novel processes, materials, and characterization methods for creating high-performance, ultra-compact, and energy-efficient microelectronic devices. Your groundbreaking work will directly contribute to shaping the future landscape of global semiconductor manufacturing and addressing complex challenges in advanced packaging, enabling technologies for AI, IoT, and high-performance computing.
At A*STAR IME, you will thrive in a collaborative and intellectually stimulating environment, fully equipped with state-of-the-art cleanroom facilities, advanced analytical tools, and a strong institutional commitment to scientific excellence. You will engage with interdisciplinary experts, collaborate closely with leading industry partners and academic institutions worldwide, and contribute to a diverse portfolio of impactful research projects designed to translate fundamental scientific discoveries into tangible technological solutions. If you possess a deep theoretical understanding of semiconductor physics and materials science, coupled with extensive practical experience in microfabrication and W2W bonding, we encourage you to apply and make a significant, lasting impact with us in vibrant Singapore.
Tanggung Jawab
- Lead and execute cutting-edge research and development projects focused on Wafer-to-Wafer (W2W) bonding technologies for advanced semiconductor packaging.
- Design, plan, and conduct experiments for process optimization, material selection, and device characterization in a cleanroom environment.
- Develop novel W2W bonding processes, including surface preparation, plasma activation, low-temperature bonding, and hybrid bonding techniques.
- Perform comprehensive characterization of bonded interfaces using advanced analytical techniques such as SEM, TEM, AFM, XPS, FTIR, and electrical measurements.
- Analyze experimental data, interpret results, troubleshoot process issues, and propose innovative solutions to overcome technical challenges.
- Collaborate effectively with cross-functional teams, industry partners, and academic collaborators to achieve project objectives and intellectual property generation.
- Document research findings, prepare technical reports, present at international conferences, and publish in high-impact scientific journals.
- Mentor and provide technical guidance to junior researchers, engineers, and students within the Advanced Packaging Materials division.
Kualifikasi
- PhD in Materials Science, Electrical Engineering, Physics, Applied Physics, Chemical Engineering, or a closely related discipline from a reputable university.
- Minimum of 3-5 years of relevant research and development experience in semiconductor processing, advanced packaging, or microfabrication, with a strong focus on Wafer-to-Wafer (W2W) bonding.
- Proven hands-on experience with cleanroom operations, semiconductor fabrication tools, and process development (e.g., sputtering, PECVD, CMP, lithography, dry etching).
- In-depth knowledge of various bonding techniques, materials science principles, interface engineering, and stress/strain analysis in semiconductor stacks.
- Proficiency in advanced material characterization techniques (e.g., SEM, TEM, AFM, XPS, FTIR, XRD) and data analysis software.
- Strong analytical, problem-solving, and critical thinking skills with a demonstrated ability to independently drive research projects.
- Excellent written and verbal communication skills, with a track record of presenting research effectively and publishing in peer-reviewed journals.
- Ability to work both independently and collaboratively in a fast-paced, multi-disciplinary research environment.