Deskripsi Pekerjaan
Join the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and play a pivotal role in shaping the future of semiconductor technology. We are seeking a highly motivated Scientist/Senior Scientist to lead and contribute to cutting-edge research in Advanced Packaging.
In this role, you will be at the forefront of thermal management solutions for next-generation semiconductor packages, specifically targeting the demanding requirements of AI, High-Performance Computing (HPC), and 2.5D/3D integrated circuits. You will collaborate with industry partners and top-tier researchers to translate laboratory breakthroughs into real-world applications, solving complex thermal bottlenecks that hinder the next wave of computing power.
The ideal candidate is an innovator with a deep understanding of thermal physics, materials science, and assembly processes, driven by the challenge of optimizing high-density, multi-chip architectures for maximum efficiency and reliability.
Tanggung Jawab
- Develop and implement advanced thermal management strategies for next-generation 2.5D/3D IC packaging.
- Conduct experimental characterization and thermal modeling/simulation of complex semiconductor packages.
- Lead R&D projects focusing on AI/HPC high-power chip architecture requirements.
- Collaborate with cross-functional teams to integrate thermal innovations into packaging workflows.
- Author technical reports, patent applications, and peer-reviewed research publications.
- Mentor junior researchers and technicians in advanced packaging methodologies.
- Engage with industry partners to understand project requirements and provide technical solutions.
Kualifikasi
- PhD or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
- Proven track record in semiconductor packaging, thermal management, or thin-film deposition technologies.
- Experience with thermal simulation software (e.g., Ansys Icepak, COMSOL, or FloTHERM).
- Strong understanding of 2.5D/3D packaging structures and their integration challenges.
- Excellent problem-solving skills and ability to work in a collaborative research environment.
- Effective communication skills with the ability to present complex technical data to stakeholders.
- Industry experience in semiconductor R&D is highly desirable.