Deskripsi Pekerjaan
Join Patsnap, a global leader in IP and R&D intelligence, and be the driving force behind our revolutionary Eureka Materials Agent. We are seeking an exceptional Semiconductor Reverse Engineering Specialist to act as our AI Domain Expert. This is a unique opportunity to bridge the gap between advanced hardware analysis and cutting-edge artificial intelligence.
In this pivotal role, you will leverage your deep expertise in semiconductor processes, device physics, and circuit analysis to train and refine the Eureka AI. You will ensure the highest level of technical accuracy as the platform generates insights into materials and manufacturing processes. Your work will directly impact how global innovators solve complex engineering challenges. If you are a hands-on expert who thrives on deconstructing the latest chip technologies and pouring that knowledge into an AI platform, this role is for you.
At Patsnap, we empower the world's leading innovators. Our Eureka platform uses AI to unlock the secrets within millions of patents and technical documents. As the Semiconductor Domain Expert, you will curate ground-truth data, validate complex technical relationships, and push the boundaries of what an AI can understand about the physical world of semiconductors. You will work with a world-class team of data scientists, engineers, and patent experts. Your insights will shape the features of the Eureka Materials Agent, making it the go-to platform for reverse engineering insights and competitive technical intelligence.
Tanggung Jawab
- Act as the primary semiconductor domain authority for the Eureka Materials Agent, ensuring AI-generated content is technically accurate and commercially relevant.
- Perform systematic reverse engineering of semiconductor devices (ICs, memory, advanced packaging) to extract architectural, process, and material insights.
- Develop and curate high-quality labeled datasets to train and validate machine learning models on semiconductor fabrication and materials science.
- Analyze patent landscapes and technical literature to identify key technological trends and translate them into targeted AI training objectives.
- Collaborate closely with data scientists and software engineers to define product features that meet the complex workflow needs of reverse engineering professionals.
- Conduct competitive teardown analyses to benchmark performance, power, and technology sophistication across leading foundries and IDMs.
- Author comprehensive technical reports, case studies, and internal knowledge bases that demonstrate the value proposition of the Eureka AI platform.
Kualifikasi
- Master's or PhD in Electrical Engineering, Microelectronics, Materials Science, Physics, or a closely related technical field.
- Minimum of 5 years of hands-on experience in semiconductor reverse engineering, failure analysis, process integration, or competitive technical intelligence.
- Profound knowledge of advanced CMOS logic (FinFET, GAA) and memory (3D NAND, DRAM) process flows and device architectures.
- Solid understanding of advanced packaging technologies (e.g., 2.5D/3D stacking, hybrid bonding, chiplets).
- A passion for AI/ML and a strong desire to apply deep domain expertise to the development of AI agents and large language models for engineering.
- Experience with semiconductor characterization and imaging tools (SEM, TEM, EDS, FIB, probe stations).
- Exceptional analytical skills with the ability to synthesize complex, multi-source technical information into structured insights.
- Excellent communication skills and a demonstrated ability to influence product roadmaps and collaborate across multidisciplinary teams.