Deskripsi Pekerjaan
Are you a seasoned engineer with a passion for precision and semiconductor excellence? Kulicke & Soffa, a global leader in semiconductor assembly and packaging solutions, is looking for a Senior Engineer I, Operations Engineering to join our elite team in Singapore. In this role, you will be at the forefront of innovation, ensuring our advanced packaging equipment meets the most rigorous performance standards in the industry.
You will play a pivotal role in the qualification process, bridging the gap between design and high-volume manufacturing. By meticulously verifying machine calibration, setup, and process bonding, you ensure that our clients receive nothing less than world-class performance. We are seeking a technical expert who thrives in a fast-paced manufacturing environment and possesses an analytical mindset to solve complex operational challenges.
Join us in shaping the future of connectivity and power electronics. If you have the expertise to drive process optimization and maintain the high quality that Kulicke & Soffa is known for, we want to hear from you.
Tanggung Jawab
- Lead the qualification and verification process for advanced semiconductor packaging equipment.
- Perform comprehensive machine calibration, ensuring compliance with internal and international quality standards.
- Execute precise process bonding verification to meet technical specifications and performance benchmarks.
- Collaborate with cross-functional teams to troubleshoot and resolve manufacturing process bottlenecks.
- Develop and implement standard operating procedures (SOPs) for machine setup and operational efficiency.
- Analyze performance data to identify trends and drive continuous improvement initiatives.
- Mentor junior engineers and technicians on best practices for equipment operation and quality assurance.
- Coordinate with R&D departments to facilitate the seamless transition of new products into full-scale manufacturing.
Kualifikasi
- Bachelor’s degree in Mechanical, Electrical, Mechatronics Engineering, or a related field.
- Minimum 5-7 years of experience in semiconductor equipment engineering or a high-precision manufacturing environment.
- Strong technical expertise in wire bonding, flip chip, or advanced packaging processes.
- Proficiency in data analysis tools and quality management systems (e.g., SPC, FMEA, 8D).
- Proven ability to interpret technical schematics, blueprints, and engineering documentation.
- Excellent communication skills with the ability to bridge technical requirements and operational execution.
- Strong problem-solving mindset with a focus on root-cause analysis and sustainable solutions.
- Ability to work effectively in a high-pressure, deadline-driven global production environment.