Deskripsi Pekerjaan
Are you ready to push the boundaries of semiconductor innovation? Micron Semiconductors is seeking a highly skilled Senior Engineer for our Process Development (PD) Grind/Trim team in Singapore. As a key member of our dynamic team, you will play a pivotal role in advancing 3D NAND technology, specifically focusing on the critical Grind and Trim processes that define our next-generation memory solutions.
In this role, you will lead complex technical projects, collaborate with cross-functional global teams, and implement cutting-edge process improvements to drive yield, quality, and cost-efficiency. If you are passionate about process characterization, root cause analysis, and scaling semiconductor technologies to new heights, Micron offers the perfect environment for your career growth.
Tanggung Jawab
- Develop and optimize Grind and Trim processes for advanced 3D NAND architecture to meet aggressive performance and reliability targets.
- Lead process characterization and troubleshooting efforts, utilizing advanced statistical analysis tools to identify root causes of process deviations.
- Collaborate with equipment vendors and internal teams to perform tool evaluation, qualification, and process transfer to high-volume manufacturing.
- Design and execute Experiments (DOE) to enhance process margin and robustness.
- Mentoring junior engineers and providing technical guidance to cross-functional manufacturing and integration teams.
- Implement data-driven solutions to improve cycle time, reduce scrap, and optimize manufacturing throughput.
- Manage complex projects, ensuring alignment with global roadmap timelines and quality standards.
Kualifikasi
- Bachelor's or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, or a related technical discipline.
- Minimum 5+ years of experience in semiconductor process development, specifically in wafer thinning, grinding, or dicing/trimming operations.
- Strong technical expertise in 3D NAND or advanced memory process integration.
- Proven ability to utilize JMP or similar statistical software for data analysis and process control.
- Strong project management skills with the ability to lead cross-functional initiatives in a high-pressure manufacturing environment.
- Excellent communication and interpersonal skills, with the ability to work effectively in a global, multicultural environment.
- Deep understanding of Semiconductor Equipment Engineering (SEE) and process-to-hardware interaction.