Deskripsi Pekerjaan
Join Qualcomm, a global leader in wireless technology and semiconductor innovation, as a Senior Engineer in Process Development (Interconnect Plating) based in Singapore. In this critical role, you will drive the development, qualification, and transfer of advanced processes, materials, and manufacturing technologies for interconnect plating into high-volume production.
You will collaborate with cross-functional teams including R&D, Product Engineering, and Manufacturing to optimize process parameters, improve yield, and reduce cost. Your expertise in interconnect plating processes will be essential in scaling cutting-edge innovations from lab to fab.
As a Senior Engineer, you will lead complex experiments, analyze data, and implement robust solutions that meet performance and reliability specifications. You will also mentor junior engineers and contribute to the continuous improvement of manufacturing excellence. Strong knowledge of design of experiments (DOE), statistical process control (SPC), and failure analysis is required.
We are looking for a proactive problem-solver with a passion for semiconductor technology. Through your work, you will directly impact the quality and efficiency of our products, enabling the next generation of connected devices.
Qualcomm offers a stimulating work environment with state-of-the-art facilities, and a culture that fosters innovation, collaboration, and professional growth. You will have the opportunity to work on groundbreaking technologies and make a tangible difference.
If you are ready to take your career to the next level, apply today for the Senior Engineer, Process Development (Interconnect Plating) position at Qualcomm in Singapore.
Tanggung Jawab
- Develop, qualify, and transfer new processes, materials, and technologies for interconnect plating into high-volume manufacturing.
- Design and execute experiments (DOE) to optimize process parameters and improve yield, cost, and cycle time.
- Collaborate with cross-functional teams to drive process validation and integration.
- Analyze manufacturing data to identify process improvement opportunities and implement corrective actions.
- Lead technology transfer activities from R&D to manufacturing sites.
- Provide technical mentorship to junior engineers and technicians.
- Ensure all processes adhere to safety, quality, and regulatory requirements.
- Document process specifications and best practices for effective knowledge transfer.
Kualifikasi
- Bachelor's or Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, or related field.
- Minimum 5 years of experience in semiconductor process development, with a focus on interconnect plating or similar areas.
- Strong knowledge of electrochemical deposition, wafer fabrication, and packaging processes.
- Experience with design of experiments (DOE), SPC, and data analysis tools.
- Excellent problem-solving skills and ability to work in a fast-paced environment.
- Effective communication and cross-functional collaboration skills.
- Ability to manage multiple projects and prioritize tasks.
- Familiarity with high-volume manufacturing environments.