Deskripsi Pekerjaan
Are you an expert in semiconductor back-end processes looking to make a significant impact in the high-growth advanced packaging sector? The Supreme HR Advisory is currently partnering with a leading industry player to recruit a Senior Thermo Compression Bonding (TCB) / Flip Chip Bonding Engineer based in the North Region of Singapore.
In this critical role, you will be the technical lead responsible for optimizing bonding processes for high-performance semiconductor devices. We are looking for a hands-on professional who thrives in a dynamic cleanroom environment and possesses a deep understanding of thermal mechanics and interconnect technology. If you are passionate about precision engineering and want to work at the forefront of next-generation packaging technologies, we want to hear from you.
Tanggung Jawab
- Lead process development and optimization for Thermo Compression Bonding (TCB) and Flip Chip assembly operations.
- Troubleshoot complex equipment and process issues to maximize yield and throughput.
- Collaborate with cross-functional teams, including R&D and Quality, to qualify new product introductions (NPI).
- Analyze statistical process control (SPC) data to identify trends and implement corrective/preventive actions.
- Mentor junior engineers and technicians on best practices for advanced packaging assembly.
- Drive continuous improvement projects to reduce cycle time and minimize material wastage.
- Oversee equipment calibration and maintenance schedules to ensure strict adherence to safety and quality standards.
Kualifikasi
- Bachelor’s or Master’s Degree in Mechanical Engineering, Electronics, Materials Science, or a related field.
- 5–15 years of hands-on experience in semiconductor packaging, specifically within TCB and Flip Chip processes.
- Proven technical proficiency in managing bonding equipment and high-precision assembly processes.
- Deep understanding of materials interaction, thermal dynamics, and flip-chip interconnect reliability.
- Strong analytical skills with proficiency in statistical software (e.g., JMP, Minitab).
- Excellent problem-solving mindset with a track record of improving process yields.
- Ability to work independently and effectively within a fast-paced manufacturing environment.