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Manufacturing, Transport & Logistics 🏢 Full Time ⭐️ Terverifikasi

Senior HIG-HBM Product Engineer - Media Health Reliability

Micron Semiconductors
Singapore
Estimasi Gaji
SGD 120.000 – SGD 180.000
Live Update
13 Juli 2026
Batas Akhir
13 Jul 2027

Deskripsi Pekerjaan

Join Micron Semiconductors as a Senior HIG-HBM Product Engineer and lead critical initiatives in High Bandwidth Memory reliability. This high-impact role empowers you to drive excellence in media health reliability, quality assurance, cost optimization, and cycle time reduction for cutting-edge semiconductor products. You'll work at the forefront of memory technology innovation, collaborating with cross-functional teams to solve complex engineering challenges and ensure our HBM solutions meet the highest industry standards.

As a key player in our product engineering team, you'll develop and implement robust testing methodologies, analyze failure data, and lead continuous improvement initiatives. Your expertise will directly contribute to enhancing product longevity and performance, positioning Micron as a leader in the competitive semiconductor market. If you're passionate about pushing the boundaries of memory technology and thrive in a dynamic, results-driven environment, this role offers an exceptional opportunity to shape the future of semiconductor reliability.

Tanggung Jawab

  • Lead HBM media health reliability initiatives through rigorous testing and data analysis
  • Develop and implement quality control protocols for HBM manufacturing processes
  • Optimize production cycle times while maintaining stringent quality standards
  • Collaborate with cross-functional teams to resolve engineering challenges
  • Drive continuous improvement programs for yield enhancement and cost reduction
  • Analyze failure modes and implement corrective actions for HBM products
  • Maintain technical documentation and reliability metrics reporting

Kualifikasi

  • Bachelor's degree in Electrical Engineering, Materials Science, or related field
  • Minimum 5 years of experience in semiconductor manufacturing or memory product engineering
  • Expertise in HBM technology, reliability engineering, and statistical process control
  • Strong analytical skills with experience in failure analysis and root cause investigation
  • Proficiency in data analysis tools (e.g., JMP, Minitab) and programming languages
  • Experience leading cross-functional engineering projects and teams
  • Knowledge of semiconductor fabrication processes and quality standards (ISO, JEDEC)

Keahlian yang Dibutuhkan

HBM Reliability Engineering Quality Assurance Semiconductor Manufacturing Data Analysis Statistical Process Control Failure Analysis Cross-functional Leadership Product Engineering Media Health Cost Optimization Cycle Time Reduction

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