Beranda Loker Detail
O
Engineering 🏢 Full Time ⭐️ Terverifikasi

Senior PMO Project Engineer (Wire Bond Expertise)

onsemi
Seremban, Negeri Sembilan, Malaysia
Estimasi Gaji
MYR 8.500 – MYR 14.000
Live Update
3 Mei 2026
Batas Akhir
3 Mei 2027

Deskripsi Pekerjaan

Are you an experienced Project Engineer with deep technical expertise in Wire Bond processes? onsemi is seeking a highly skilled Senior PMO Project Engineer to join our dynamic team in Seremban. In this pivotal role, you will act as a bridge between technical engineering and project management, driving continuous improvement initiatives that directly impact our manufacturing efficiency, cost-reduction targets, and quality standards.

As part of our global PMO team, you will lead complex projects focused on optimizing Wire Bond production lines. You will utilize your technical acumen to troubleshoot, refine processes, and implement robust solutions that enhance site performance and global competitiveness. This is an excellent opportunity for a results-driven professional to influence semiconductor manufacturing excellence in a high-impact, fast-paced environment.

Tanggung Jawab

  • Lead and manage multi-disciplinary engineering projects with a focus on Wire Bond process optimization.
  • Drive continuous improvement programs (CIP) to reduce cost, minimize waste, and improve cycle times.
  • Collaborate with cross-functional teams to resolve complex technical issues related to Wire Bond manufacturing.
  • Monitor and analyze site performance metrics, providing actionable insights to senior leadership.
  • Ensure all project milestones are delivered on time, within budget, and meeting strict quality compliance standards.
  • Develop and implement standard operating procedures (SOPs) for enhanced process reliability.
  • Provide technical mentorship and guidance to junior engineering staff within the PMO framework.

Kualifikasi

  • Bachelor’s degree in Mechanical, Electrical, Electronics Engineering, or a related field.
  • Minimum 5-7 years of professional experience in semiconductor manufacturing, specifically with Wire Bond technology.
  • Proven track record in Project Management (PMO) or leading technical engineering improvement projects.
  • Strong knowledge of wire bonding equipment, materials, and process troubleshooting.
  • Proficiency in statistical process control (SPC), Six Sigma methodologies, or Lean manufacturing tools.
  • Excellent analytical skills with the ability to interpret technical data and translate it into project strategy.
  • Strong interpersonal and communication skills, capable of influencing stakeholders at all levels.

Keahlian yang Dibutuhkan

Wire Bond Semiconductor Manufacturing PMO Project Management Continuous Improvement Six Sigma SPC Process Optimization Lean Manufacturing Engineering Leadership

Siap Mengambil Tantangan Ini?

Pastikan resume Anda sudah siap. Kirimkan lamaran Anda sekarang sebelum tanggal deadline.

Lamar Sekarang

Lowongan Terkait

Rekomendasi pekerjaan serupa untuk Anda

Lihat Semua