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Engineering 🏢 Full Time ⭐️ Terverifikasi

Senior Supervisor, Assembly Test

onsemi
Seremban, Negeri Sembilan
Estimasi Gaji
MYR 4.500 – MYR 6.500
Terbaru
Live Update
6 Juni 2026
Batas Akhir
6 Jun 2027

Deskripsi Pekerjaan

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial sectors, we are seeking a dedicated Senior Supervisor, Assembly Test to join our team in Seremban. In this pivotal role, you will lead a high-performing team, ensuring the highest standards of quality and efficiency in our semiconductor manufacturing processes. We offer a dynamic work environment where your leadership will directly impact the production of cutting-edge technology that powers the world.

As a leader in power and analog technologies, onsemi provides a platform for growth and innovation. You will be responsible for overseeing critical assembly and test operations, driving process improvements, and fostering a culture of excellence within your department.

Tanggung Jawab

  • Lead and mentor a team of assembly and test technicians to ensure production targets are met efficiently and on schedule.
  • Oversee daily manufacturing operations, ensuring strict adherence to ISO quality standards and safety protocols.
  • Implement and monitor Continuous Improvement (CI) initiatives, including Lean and Six Sigma methodologies, to optimize workflow and reduce waste.
  • Conduct regular performance reviews and provide targeted training to enhance team technical skills and product knowledge.
  • Collaborate with production planning and engineering departments to troubleshoot complex assembly issues and implement corrective actions.
  • Manage inventory levels of test equipment and consumables to prevent production downtime.

Kualifikasi

  • Minimum 3-5 years of supervisory experience in semiconductor assembly, packaging, or electronics manufacturing.
  • Degree in Electrical, Electronics, Mechanical, or Industrial Engineering, or equivalent technical qualification.
  • Strong understanding of IPC standards and semiconductor assembly processes (wire bonding, die attach, packaging).
  • Proven ability to lead teams effectively, with excellent communication and interpersonal skills.
  • Familiarity with MES (Manufacturing Execution Systems) and ERP software is highly desirable.
  • Ability to work in a fast-paced manufacturing environment and adapt to changing priorities.

Keahlian yang Dibutuhkan

Semiconductor Manufacturing Assembly Test Quality Control Lean Manufacturing Six Sigma Leadership Process Improvement ISO Standards Wire Bonding Die Attach MES Systems

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