Deskripsi Pekerjaan
Are you an experienced Electrochemical Deposition (ECP) engineer ready to elevate your career in the fast-paced semiconductor industry? Our client, a premier semiconductor manufacturer, is searching for a talented Senior Thin Film Process Engineer (ECP) to join their innovative team in Ang Mo Kio. This is a pivotal role for a technical expert who thrives on solving complex process challenges and driving manufacturing excellence.
The Opportunity
As a Senior Thin Film Process Engineer, you will be responsible for sustaining and optimizing copper electroplating processes within a high-volume manufacturing environment. You will serve as the technical authority for your area, utilizing your deep expertise in ECP to troubleshoot issues, improve yield, and implement robust process controls. Your strong cross-functional collaboration skills will be essential as you partner with equipment, integration, and R&D teams to introduce new technologies and enhance existing ones. This role offers the chance to make a significant impact on product quality and operational efficiency while working with cutting-edge semiconductor equipment.
What We Are Looking For
We are seeking a proactive, results-driven engineer with a solid foundation in semiconductor thin film processes. The ideal candidate possesses a deep understanding of copper plating electrochemistry, defect reduction techniques, and statistical process control (SPC). You must be comfortable working in a cleanroom environment and have a proven ability to lead technical projects and mentor junior engineers. Excellent communication, analytical thinking, and a commitment to continuous improvement are the hallmarks of our ideal candidate. If you are passionate about semiconductor technology and ready to take on a challenging senior role, we encourage you to apply.
Tanggung Jawab
- Own and sustain Electrochemical Deposition (ECP) thin film processes for advanced semiconductor nodes.
- Develop, optimize, and qualify new ECP processes to improve yield, throughput, and defect performance.
- Troubleshoot complex process issues utilizing structured problem-solving methodologies (e.g., 8D, DMAIC).
- Collaborate closely with cross-functional teams (Equipment, Integration, R&D, Manufacturing) to resolve technical challenges.
- Implement and maintain Advanced Process Control (APC) systems and Fault Detection and Classification (FDC).
- Monitor critical process parameters and generate reports on process health, driving continuous improvement projects.
- Mentor and guide junior process engineers and technicians in best practices and process development.
- Lead or contribute to cost reduction and productivity enhancement initiatives within the thin film module.
Kualifikasi
- Bachelor’s, Master’s, or PhD in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline.
- Minimum 5-8 years of hands-on experience in semiconductor thin film process engineering, specifically in Electrochemical Deposition (ECP) and copper plating.
- Deep understanding of electrochemistry, copper gap fill, and related defect mechanisms.
- Proven track record in process development, qualification, and transfer to high-volume manufacturing.
- Strong knowledge of Statistical Process Control (SPC), Design of Experiments (DOE), and equipment troubleshooting.
- Excellent communication and interpersonal skills with the ability to work effectively in a global, cross-functional team environment.
- Self-starter with strong analytical and critical thinking skills, capable of managing multiple priorities.
- Experience with semiconductor metrology and defect inspection tools is highly desirable.