Deskripsi Pekerjaan
Join onsemi, a leading semiconductor company, as a Senior Wire Bond NPI Engineer based in Seremban, Malaysia. In this pivotal role, you will spearhead the qualification and successful launch of wire bond and IVI processes, driving innovation in semiconductor packaging technology.
You will be responsible for leading EFAR investigations to resolve complex technical challenges, while also defining the wire bond technology and material roadmaps to ensure our products remain at the forefront of the industry. This role offers the opportunity to work closely with cross-functional teams including R&D, production, and quality assurance to optimize processes and maintain the highest standards of manufacturing excellence.
Ideal candidates will thrive in a dynamic manufacturing environment, possess strong technical acumen, and demonstrate a passion for continuous improvement. If you are looking to advance your career in semiconductor engineering and make a significant impact on cutting-edge technology development, we want to hear from you.
Tanggung Jawab
- Lead wire bond and IVI process qualification and safe launch activities
- Drive EFAR (Engineering Failure Analysis Report) investigations and implement corrective actions
- Define and maintain wire bond technology and material roadmaps
- Collaborate with R&D, production, and quality teams to ensure seamless new product introduction
- Optimize wire bond processes to improve yield, throughput, and quality
- Develop and document standard operating procedures and process parameters
- Provide technical support during production ramp-up and resolve equipment-related issues
- Evaluate new materials and equipment for process improvement initiatives
Kualifikasi
- Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials Science, or related field)
- Minimum 5 years of experience in semiconductor packaging or wire bond processes
- Proven track record in NPI (New Product Introduction) and process qualification
- In-depth knowledge of wire bond equipment (Kulicke & Soffa, ASM Pacific, or similar)
- Experience with failure analysis and root cause analysis methodologies
- Familiarity with statistical process control (SPC) and Six Sigma tools
- Strong problem-solving, analytical, and communication skills
- Ability to work effectively in a fast-paced team environment