Deskripsi Pekerjaan
Renesas is a global leader in semiconductor solutions, powering billions of devices worldwide. We are at the forefront of advanced package technology, actively developing next-generation power packages for AI data centers that demand unparalleled performance, efficiency, and reliability. As a Senior Staff Package Design Engineer in our Ipoh, Perak office, you will be a key contributor to this mission, driving the design and development of innovative packaging solutions that will power the future of artificial intelligence and cloud computing.
In this highly visible role, you will lead complex package design projects from concept through production, collaborating with cross-functional teams to define architecture, optimize electrical and thermal performance, and ensure manufacturability. You will leverage your deep expertise in semiconductor packaging to solve challenging technical problems and mentor junior engineers. If you are passionate about pushing the boundaries of what’s possible in package technology and want to make a tangible impact on the AI revolution, we invite you to apply.
Your primary focus will be on developing power packages tailored to the stringent requirements of AI data center applications. You will conduct advanced simulations, explore new materials and processes, and work closely with suppliers to bring cutting-edge solutions to market. This is an outstanding opportunity to grow your career at a global innovation leader while contributing to the next wave of technology transformation.
Tanggung Jawab
- Lead the design and development of advanced power packages for AI data center applications.
- Define package architecture and selection of materials to meet electrical, thermal, and reliability requirements.
- Conduct package-level simulations (electrical, thermal, mechanical) to optimize performance.
- Collaborate with cross-functional teams including design, process, and manufacturing to ensure design for manufacturability.
- Drive innovation in package technology by exploring new materials and processes.
- Perform design reviews and provide technical guidance to junior engineers.
- Develop and maintain documentation for package designs and specifications.
- Interface with suppliers and partners to evaluate new packaging solutions.
Kualifikasi
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, or related field.
- Minimum 8 years of experience in semiconductor package design and development.
- Strong knowledge of package technologies such as BGA, QFN, flip-chip, and advanced packages.
- Experience with power packages and thermal management techniques.
- Proficiency in CAD tools (e.g., Cadence, Mentor Graphics) and simulation tools (e.g., ANSYS, Comsol).
- Understanding of semiconductor device physics and reliability.
- Excellent problem-solving skills and attention to detail.
- Strong communication skills and ability to work in a team environment.