Beranda Loker Detail
R
Engineering 🏢 Full Time ⭐️ Terverifikasi

Sr Staff Package Design Engineer

Renesas
Ipoh, Perak
Estimasi Gaji
MYR 120.000 – MYR 180.000
Live Update
27 Mei 2026
Batas Akhir
27 Mei 2027

Deskripsi Pekerjaan

Join Renesas as a Sr Staff Package Design Engineer and become part of our cutting-edge team developing next-generation packaging technologies for AI data centers. As a leader in the semiconductor industry, we are pushing the boundaries of power package design to meet the demands of tomorrow's computing challenges. In this critical role, you will drive innovation in advanced packaging solutions, working with state-of-the-art materials and processes to optimize performance, reliability, and thermal management. You'll collaborate with cross-functional teams across R&D, manufacturing, and product development to bring groundbreaking technologies to market. Renesas offers a dynamic environment where your expertise will directly impact the future of semiconductor packaging and contribute to the advancement of AI infrastructure worldwide.

Tanggung Jawab

  • Lead the design and development of advanced power packages for AI data center applications
  • Optimize package architecture for thermal performance, electrical characteristics, and mechanical reliability
  • Collaborate with cross-functional teams including R&D, process engineering, and product management
  • Define package specifications and requirements based on system-level needs
  • Develop and implement testing methodologies to validate package performance
  • Mentor junior engineers and provide technical guidance on package design best practices
  • Stay current with industry trends and emerging packaging technologies

Kualifikasi

  • Bachelor's degree in Electrical Engineering, Materials Science, or related field; Master's or PhD preferred
  • Minimum 10 years of experience in semiconductor package design and development
  • Expertise in power package technologies, including wire bonding, flip-chip, and advanced substrates
  • Strong knowledge of thermal management and electrical modeling for high-power applications
  • Experience with CAD tools for package design (e.g., Cadence, Mentor Graphics)
  • Demonstrated ability to lead complex technical projects and mentor engineering teams
  • Excellent problem-solving skills and attention to detail

Keahlian yang Dibutuhkan

Package Design Semiconductor Technology Thermal Management Electrical Modeling CAD Design Power Electronics AI Hardware Team Leadership Technical Mentorship

Siap Mengambil Tantangan Ini?

Pastikan resume Anda sudah siap. Kirimkan lamaran Anda sekarang sebelum tanggal deadline.

Lamar Sekarang

Lowongan Terkait

Rekomendasi pekerjaan serupa untuk Anda

Lihat Semua