Deskripsi Pekerjaan
SanDisk, a global leader in flash storage solutions and a proud brand of Western Digital, is on the lookout for a highly skilled and innovative Staff Engineer, Packaging Engineering (Thermal Design) to strengthen our advanced engineering team in Batu Kawan, Penang, Malaysia. This is an exceptional opportunity for a seasoned engineer to make a profound impact on the development of cutting-edge semiconductor and flash storage products.
As a Staff Engineer specializing in thermal design, you will be instrumental in ensuring the performance, reliability, and longevity of our next-generation devices. Your core responsibilities will include leading complex thermal analyses, employing advanced Computational Fluid Dynamics (CFD) modeling techniques, and driving mechanical development from initial concept through to mass production. You will tackle intricate thermal challenges across various product lines, working with state-of-the-art materials and manufacturing processes.
We are seeking a proactive problem-solver with a deep understanding of heat transfer, fluid dynamics, and semiconductor packaging architectures. The ideal candidate will possess a proven track record in optimizing thermal solutions for high-performance electronic devices, contributing to design for manufacturability (DFM), and collaborating effectively with multi-disciplinary teams including product design, process engineering, and reliability. If you are passionate about pushing the boundaries of technology in the flash memory and storage industry, and eager to contribute to a world-renowned brand, we encourage you to apply and help shape the future of digital storage.
Tanggung Jawab
- Lead and execute comprehensive thermal design and analysis for new and existing semiconductor packaging architectures and flash storage products.
- Perform advanced CFD modeling and simulations to predict thermal performance, identify hotspots, and optimize heat dissipation strategies.
- Drive mechanical development, material selection, and structural analysis to ensure robust and thermally efficient packaging solutions.
- Collaborate closely with cross-functional teams including electrical engineering, product design, process development, and reliability to integrate thermal considerations throughout the product lifecycle.
- Design and conduct experiments for thermal characterization, validate simulation results, and perform root cause analysis for thermal-related failures.
- Evaluate new packaging technologies and materials for thermal performance improvements and cost optimization.
- Develop and maintain best practices, methodologies, and tools for thermal design and analysis within the engineering team.
- Mentor junior engineers and contribute to the technical growth of the packaging engineering department.
Kualifikasi
- Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field.
- Minimum of 8-12 years of relevant experience in semiconductor packaging thermal design and mechanical development.
- Demonstrated expertise in CFD software such as Ansys IcePak, Flotherm, or similar tools, with a strong understanding of meshing strategies and boundary conditions.
- Solid understanding of heat transfer principles (conduction, convection, radiation) and fluid dynamics.
- Proven experience in thermal characterization, experimental validation, and failure analysis for electronic components.
- Familiarity with semiconductor device physics, packaging processes, and materials (e.g., molding compounds, die attach materials, substrates).
- Proficiency in CAD tools (e.g., SolidWorks, AutoCAD) for mechanical design and packaging layout is a plus.
- Excellent analytical, problem-solving, and communication skills, with the ability to work effectively in a global, cross-functional team environment.