Deskripsi Pekerjaan
Join onsemi's innovative engineering team as a Staff Engineer specializing in Process Packaging & Assembly. You'll lead the development of advanced internal and external package structures, collaborating with designers and material experts to optimize assembly processes while maintaining cost efficiency. This role requires deep technical expertise in semiconductor packaging technologies, process flow optimization, and material science. You'll drive cross-functional initiatives to enhance product reliability, manufacturability, and performance in a fast-paced R&D environment. Your contributions will directly impact next-generation semiconductor packaging solutions, making this an ideal opportunity for an experienced engineer passionate about technological innovation.
Tanggung Jawab
- Lead design and development of internal/external package structures for semiconductor products
- Collaborate with designers and material experts to optimize assembly process flows
- Develop cost-effective packaging solutions while meeting technical specifications
- Analyze and improve manufacturing processes for enhanced yield and reliability
- Drive continuous improvement initiatives in packaging technologies
- Coordinate cross-functional teams to resolve technical challenges
- Stay current with industry advancements in packaging materials and assembly techniques
Kualifikasi
- Bachelor's degree in Electrical/Mechanical Engineering or related field (Master's preferred)
- Minimum 8 years of experience in semiconductor packaging or assembly processes
- Expertise in package structure design and material selection
- Strong knowledge of assembly process flow optimization
- Proven experience in cost structure analysis and reduction
- Proficient in CAD tools and process simulation software
- Excellent problem-solving and cross-functional collaboration skills