Deskripsi Pekerjaan
Adecco is partnering with a premier global leader in semiconductor packaging and electronic assembly solutions to find a dedicated Staff Process Engineer. This is a pivotal role focusing on advanced manufacturing processes including Die Attach (DA), Flip Chip (FC), and TCB (Thermo Compression Bonding). As part of our engineering team, you will drive process optimization, enhance yield rates, and implement continuous improvement initiatives to ensure world-class production standards. You will be responsible for analyzing process data, identifying root causes of defects, and collaborating with R&D and production teams to drive efficiency. This position offers a competitive remuneration package, including AWS and VB, and the chance to work on cutting-edge technology in the semiconductor industry. If you are looking to advance your career in a dynamic environment, we encourage you to apply.
Tanggung Jawab
- Lead and optimize Die Attach (DA), Flip Chip (FC), and TCB process flows to ensure high yield and reliability.
- Analyze production data and statistical process control (SPC) charts to identify trends and deviations.
- Troubleshoot and resolve complex process and equipment issues to minimize downtime.
- Collaborate with cross-functional teams (R&D, Quality, Production) to implement corrective actions.
- Conduct root cause analysis (RCA) for yield loss and implement permanent process improvements.
- Manage process documentation, standard operating procedures (SOPs), and change controls.
- Participate in equipment qualification and new process transfer activities.
Kualifikasi
- Bachelor’s or Master’s degree in Electrical, Electronic, Mechanical, or Chemical Engineering.
- Minimum of 5-8 years of experience in semiconductor packaging, specifically in DA, FC, or TCB processes.
- Strong understanding of semiconductor materials, equipment, and assembly techniques.
- Proven track record in process optimization, yield improvement, and problem-solving.
- Excellent communication skills and ability to work effectively in a fast-paced manufacturing environment.
- Knowledge of SPC, FMEA, and Six Sigma methodologies is a plus.