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Engineering 🏢 Full Time ⭐️ Terverifikasi

TD Device Engineer (BCD/RFSOI/SiPh/Advanced Packaging)

Adecco
Central Region
Estimasi Gaji
SGD 6.000 – SGD 9.000
Live Update
27 Mei 2026
Batas Akhir
27 Mei 2027

Deskripsi Pekerjaan

We are partnering with a leading semiconductor organization to find a highly skilled TD Device Engineer to join their advanced technology development team. In this role, you will be at the forefront of innovation, working on cutting-edge process technology nodes including BCD, RFSOI, and Silicon Photonics (SiPh), as well as advanced packaging solutions.

As a Device Engineer, you will be responsible for device characterization, modeling, and process integration, ensuring optimal performance, reliability, and yield for next-generation semiconductor products. You will collaborate with cross-functional teams, including design, process integration, and manufacturing, to drive technology enablement and product success. If you are a passionate engineer with a deep understanding of device physics and process integration, we invite you to take the next step in your career with this challenging and rewarding opportunity.

Tanggung Jawab

  • Develop and optimize device architectures for BCD, RFSOI, and Silicon Photonics technologies.
  • Conduct device characterization and analysis to support technology development and yield improvement.
  • Perform TCAD modeling and simulation to guide device design and performance enhancement.
  • Collaborate with process integration teams to define process specs and solve integration challenges.
  • Execute reliability testing and failure analysis to ensure product quality and robustness.
  • Support advanced packaging integration activities, ensuring electrical and thermal performance targets are met.
  • Analyze electrical data to correlate process variations with device performance metrics.

Kualifikasi

  • Bachelor’s, Master’s, or PhD in Electrical Engineering, Physics, or Materials Science.
  • Minimum 3-5 years of experience in semiconductor device engineering or process integration.
  • Strong fundamental knowledge of device physics for BCD, RFSOI, or SiPh technologies.
  • Proficiency in TCAD tools (e.g., Sentaurus, Silvaco) and semiconductor characterization equipment.
  • Experience with statistical data analysis tools (e.g., JMP, Spotfire).
  • Excellent problem-solving skills and the ability to work in a fast-paced environment.
  • Proven track record of collaborating with cross-functional teams in a TD or manufacturing environment.

Keahlian yang Dibutuhkan

Device Physics BCD RFSOI Silicon Photonics Advanced Packaging TCAD Semiconductor Process Integration Device Characterization Failure Analysis JMP

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