Deskripsi Pekerjaan
AIC Semiconductor, a leading manufacturer in the semiconductor industry, is seeking a skilled Wafer Saw Engineer to join our team at our state-of-the-art facility located in Kulim Hi-Tech Park, Kedah.
In this full-time role, you will be responsible for providing comprehensive engineering support for all process-sustaining activities and new device introductions within the Front-of-Line (FOL) process. You will play a pivotal role in optimizing wafer sawing processes, enhancing yield, reducing costs, and ensuring product quality. As a Wafer Saw Engineer, you will collaborate with cross-functional teams to troubleshoot issues, implement process improvements, and drive continuous innovation.
We are looking for a highly motivated individual with solid experience in wafer dicing, strong analytical capabilities, and a deep understanding of semiconductor manufacturing. If you are passionate about process engineering and want to work with cutting-edge technology in a dynamic environment, this is the opportunity for you.
Join AIC Semiconductor and be part of a company that values technical excellence and career development. Apply now to advance your career in the heart of Malaysia's tech hub.
Tanggung Jawab
- Provide process engineering support for wafer saw operations to ensure stable and efficient production.
- Develop and qualify new device introductions (NDI) and new processes in the FOL area.
- Troubleshoot process-related issues, perform root cause analysis, and implement corrective/preventive actions.
- Monitor key performance indicators (yield, output, scrap) and drive process optimization projects.
- Collaborate with equipment and manufacturing teams to improve machine performance, uptime, and capability.
- Conduct experiments and analyze data to establish optimal process parameters for quality and throughput.
- Maintain thorough documentation for process specifications, change requests, and technical reports.
- Support internal and external audits, ensuring compliance with quality and safety standards.
Kualifikasi
- Bachelor’s degree in Electrical, Mechanical, Mechatronics, Materials Engineering, or a related field.
- Minimum 2 years of hands-on experience in wafer sawing or dicing process within semiconductor manufacturing.
- Strong knowledge of wafer dicing equipment (e.g., Disco, Accretech) and processes (blade dicing, laser grooving, TAIKO).
- Proficiency with Statistical Process Control (SPC), FMEA, and data analysis tools.
- Excellent problem-solving and critical-thinking skills, with attention to detail.
- Ability to work effectively in a cleanroom environment and handle multiple priorities.
- Good communication and interpersonal skills for cross-functional collaboration.
- Experience in FOL process integration or TAIKO thinning is an added advantage.