Deskripsi Pekerjaan
Are you ready to shape the future of memory technology? Micron Semiconductors is looking for a talented and driven Engineer for High Bandwidth Memory (HBM) & New Product Introduction (NPI) to join our elite team in Singapore. In this pivotal role, you will be at the forefront of semiconductor innovation, bridging the gap between design and high-volume manufacturing for next-generation AI and high-performance computing solutions.
You will work within a collaborative, dynamic environment where your technical expertise will directly influence the development of HBM products. We are seeking an engineer who is passionate about overcoming complex technical challenges, optimizing product performance, and accelerating time-to-market. If you thrive in a fast-paced environment and are eager to push the boundaries of what is possible in memory architecture, this is the perfect opportunity for you.
Tanggung Jawab
- Lead the NPI process for advanced HBM products, ensuring a seamless transition from design validation to high-volume manufacturing.
- Collaborate with cross-functional teams, including design, process engineering, and quality assurance, to identify and mitigate technical risks.
- Analyze electrical and physical characterization data to identify root causes for performance bottlenecks or yield limiters.
- Optimize test patterns and hardware configurations to improve product reliability and manufacturing efficiency.
- Drive continuous improvement initiatives to enhance HBM performance metrics, including power, area, and bandwidth targets.
- Manage technical documentation and reporting for product qualification milestones.
- Mentor junior engineers and contribute to the technical knowledge base regarding HBM architectures.
Kualifikasi
- Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Materials Science, or a related field.
- Minimum 3-5 years of experience in semiconductor NPI, product engineering, or related memory technology roles.
- Strong understanding of memory architectures, specifically High Bandwidth Memory (HBM) or DRAM technologies.
- Proven track record in data analysis and problem-solving using statistical software (JMP, Minitab, or Python/R).
- Familiarity with semiconductor fabrication processes, wafer sort, and final test flows.
- Strong project management skills with the ability to manage multiple priorities in a fast-paced environment.
- Excellent communication and interpersonal skills, with the ability to work effectively in a global, multicultural team.